gptkbp:instance_of
|
gptkb:microprocessor
|
gptkbp:ai
|
gptkb:Yes
|
gptkbp:aienhancements
|
gptkb:Yes
|
gptkbp:application
|
gptkb:cloud_computing
|
gptkbp:architecture
|
gptkb:Zen_4
|
gptkbp:availability
|
gptkb:Yes
widely available
|
gptkbp:cache_size
|
L1, L2, L3
up to 256 MB L3
|
gptkbp:cloud_integration
|
gptkb:Yes
|
gptkbp:cloud_optimized
|
gptkb:Yes
|
gptkbp:compatibility
|
Linux and Windows
|
gptkbp:competitors
|
gptkb:Intel_Xeon_Scalable
|
gptkbp:data_center_focus
|
gptkb:Yes
|
gptkbp:ecological_role
|
strong
|
gptkbp:form_factor
|
gptkb:servers
|
gptkbp:fuel_economy
|
high
|
gptkbp:graphics
|
No
|
https://www.w3.org/2000/01/rdf-schema#label
|
AMD EPYC 4th Gen
|
gptkbp:hyper_threading
|
gptkb:Yes
192
|
gptkbp:instruction_set
|
x86-64
|
gptkbp:is_scalable
|
up to 8 sockets
|
gptkbp:key_feature
|
high core count
|
gptkbp:launch_event
|
CES 2022
|
gptkbp:launch_price
|
varies by model
|
gptkbp:manufacturer
|
gptkb:AMD
|
gptkbp:manufacturing_process
|
5 nm
|
gptkbp:market_launch
|
gptkb:2022
|
gptkbp:market_segment
|
enterprise
|
gptkbp:memory_type
|
DDR4 and DDR5
DDR5
|
gptkbp:number_of_cores
|
96
|
gptkbp:package_manager
|
gptkb:Yes
|
gptkbp:pciexpress_version
|
5.0
|
gptkbp:performance
|
high-performance computing
varies by workload
|
gptkbp:platforms
|
gptkb:Yes
|
gptkbp:power_consumption
|
advanced
|
gptkbp:provides_information_on
|
gptkb:Yes
|
gptkbp:ram
|
up to 4 TB
up to 3200 MT/s
|
gptkbp:release_date
|
March 2022
|
gptkbp:release_year
|
gptkb:2022
|
gptkbp:reliability
|
high
|
gptkbp:scalability_features
|
multi-socket support
|
gptkbp:security_features
|
Secure Encrypted Virtualization
|
gptkbp:sister_channel
|
8
|
gptkbp:slisupport
|
gptkb:Yes
|
gptkbp:socket_type
|
SP5
|
gptkbp:target_market
|
data centers
|
gptkbp:tdp
|
up to 400 W
|
gptkbp:thermal_design_power
|
400 W
|
gptkbp:virtualization_support
|
gptkb:Yes
|
gptkbp:workload_optimization
|
gptkb:Yes
|
gptkbp:bfsParent
|
gptkb:AMD_EPYC_3rd_Gen
|
gptkbp:bfsLayer
|
7
|