Wafer Level Integrated Chip On PCB
GPTKB entity
Statements (14)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:technology
|
| gptkbp:application |
system-in-package
miniaturized electronic devices |
| gptkbp:benefit |
lower cost
improved electrical performance reduced package size |
| gptkbp:feature |
integration of chips at wafer level onto PCB
|
| gptkbp:field |
electronics
semiconductor packaging |
| https://www.w3.org/2000/01/rdf-schema#label |
Wafer Level Integrated Chip On PCB
|
| gptkbp:relatedTo |
wafer-level packaging
chip-on-board technology |
| gptkbp:bfsParent |
gptkb:WICOP
|
| gptkbp:bfsLayer |
8
|