Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:coated_with |
plated copper
|
| gptkbp:createdBy |
drilling
laser ablation |
| gptkbp:enables |
power distribution
signal routing ground connection |
| gptkbp:filling |
solder
conductive paste non-conductive paste |
| gptkbp:function |
electrical connection between PCB layers
|
| https://www.w3.org/2000/01/rdf-schema#label |
VIA (electronics)
|
| gptkbp:material |
copper
|
| gptkbp:relatedTo |
PCB manufacturing
microvia |
| gptkbp:shape |
cylindrical
|
| gptkbp:standardizedBy |
gptkb:IPC-2221
|
| gptkbp:type |
blind via
buried via through-hole via |
| gptkbp:used_in |
printed circuit board
|
| gptkbp:bfsParent |
gptkb:VIA
|
| gptkbp:bfsLayer |
6
|