Statements (13)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
chip interconnect architecture
|
| gptkbp:announced |
March 2022
|
| gptkbp:developedBy |
gptkb:Apple_Inc.
|
| gptkbp:enables |
low-latency communication between dies
|
| https://www.w3.org/2000/01/rdf-schema#label |
UltraFusion architecture
|
| gptkbp:marketedAs |
gptkb:Apple_Inc.
|
| gptkbp:memoryBusWidth |
2.5 TB/s
|
| gptkbp:purpose |
connect two M1 Max dies
|
| gptkbp:technology |
silicon interposer
|
| gptkbp:usedFor |
high-performance computing
|
| gptkbp:usedIn |
gptkb:Apple_M1_Ultra
|
| gptkbp:bfsParent |
gptkb:Apple_M1_Ultra
|
| gptkbp:bfsLayer |
5
|