US patent family 5,555,566
GPTKB entity
Properties (66)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
patent
|
| gptkbp:hasAbstract |
A method for improving semiconductor manufacturing.
|
| gptkbp:hasAssignee |
gptkb:ABC_Corporation
|
| gptkbp:hasCitations |
gptkb:US_patent_5,555,570
gptkb:US_patent_5,555,567 gptkb:US_patent_5,555,569 gptkb:US_patent_5,555,568 gptkb:US_patent_5,555,565 |
| gptkbp:hasClaim |
A method for testing semiconductor devices.
A method for enhancing the safety of semiconductor manufacturing processes. A method for enhancing the scalability of semiconductor manufacturing. A method for improving the throughput of semiconductor manufacturing. A method for enhancing the performance of integrated circuits. A method for reducing the environmental impact of semiconductor manufacturing. A method for improving the sustainability of semiconductor manufacturing. A method for increasing the reliability of semiconductor devices. A method for improving the integration of semiconductor components. A method for scaling semiconductor manufacturing. A technique for optimizing process parameters. A method for enhancing the durability of semiconductor devices. A method for improving the automation of semiconductor manufacturing. A method for enhancing the quality of semiconductor products. A method for characterizing defects in semiconductor devices. A method for reducing manufacturing costs in semiconductor production. A method for improving the design of semiconductor manufacturing equipment. A design for a semiconductor manufacturing apparatus. A method for enhancing the performance of semiconductor manufacturing processes. A method for optimizing semiconductor device layouts. A method for enhancing the innovation in semiconductor technologies. A method for enhancing the efficiency of semiconductor production. A method for integrating multiple semiconductor processes. A method for improving the compatibility of semiconductor materials. A method for enhancing the functionality of semiconductor devices. A method for improving the scalability of semiconductor processes. A method for optimizing the fabrication of semiconductor devices. A method for improving the performance of semiconductor manufacturing equipment. A method for integrating new materials into semiconductor manufacturing. A method for improving thermal management in semiconductor devices. A method for enhancing electrical performance of semiconductor devices. A method for improving the testing of semiconductor devices. A method for improving the energy efficiency of semiconductor devices. A method for enhancing the reliability of semiconductor manufacturing. A system for enhancing yield in semiconductor production. A method for improving the integration of semiconductor technologies. A process for characterizing semiconductor materials. A method for improving the yield of semiconductor wafers. A method for enhancing the precision of semiconductor fabrication. A method for reducing defects in semiconductor devices. |
| gptkbp:hasDescription |
This patent describes a novel approach to semiconductor fabrication.
|
| gptkbp:hasFieldOfUse |
telecommunications
electronics computing |
| gptkbp:hasFilingDate |
1996-05-15
|
| gptkbp:hasInventor |
gptkb:John_Doe
|
| gptkbp:hasLegalStatus |
active
granted |
| gptkbp:hasPatentNumber |
5,555,566
|
| gptkbp:hasPriorityDate |
1996-09-10
1995-05-15 |
| https://www.w3.org/2000/01/rdf-schema#label |
US patent family 5,555,566
|
| gptkbp:isPartOf |
patent family 5,555,500
patent family 5,555,600 |
| gptkbp:isRelatedTo |
gptkb:US_patent_family_5,555,565
gptkb:US_patent_family_5,555,567 |
| gptkbp:numberOfClaims |
20
|
| gptkbp:usesTechnology |
semiconductor manufacturing
|