Properties (54)
Predicate | Object |
---|---|
gptkbp:instanceOf |
patent
|
gptkbp:covers |
method of manufacturing
device for processing |
gptkbp:hasAbstract |
This patent describes a novel method.
|
gptkbp:hasAssignee |
Company XYZ
|
gptkbp:hasCitations |
10
|
gptkbp:hasClaim |
20
|
gptkbp:hasCPCClassification |
H01L 21/00
|
gptkbp:hasDescription |
Detailed description of the invention.
|
gptkbp:hasFeature |
paid
|
gptkbp:hasFieldOfUse |
electronics
|
gptkbp:hasFilingDate |
2011-02-15
|
gptkbp:hasGoals |
3
|
gptkbp:hasInternationalClassification |
H01L 21/00
|
gptkbp:hasInventor |
gptkb:John_Doe
|
gptkbp:hasLegalEvent |
patent litigation
patent grant assignment patent opposition patent assignment patent expired patent appeal patent application filed patent reexamination patent reissue maintenance fee payment patent revival patent correction patent disclaimer patent reexamination request patent surrender patent reexamination certificate patent reissue application patent interference patent reissue certificate patent reissue fee payment patent reissue grant |
gptkbp:hasLegalStatus |
active
|
gptkbp:hasMember |
5
|
gptkbp:hasPriorityDate |
2010-02-15
2031-02-15 |
gptkbp:hasPublications |
2011-02-15
|
gptkbp:hasTechnicalField |
semiconductors
|
https://www.w3.org/2000/01/rdf-schema#label |
US 7,890,123 T20 family
|
gptkbp:inventiveStep |
yes
|
gptkbp:isAssignedTo |
Company XYZ
|
gptkbp:isCitedBy |
gptkb:US_8,123,456
gptkb:US_8,654,321 |
gptkbp:isFiledIn |
gptkb:United_States
|
gptkbp:isGranted |
true
|
gptkbp:isPartOf |
T20 patent family
|
gptkbp:isPublishedIn |
gptkb:US_2011/0045678_A1
|
gptkbp:isRelatedTo |
gptkb:US_7,890,124
gptkb:US_7,890,122 |