Statements (61)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
lithography equipment
|
| gptkbp:designedFor |
advanced node technology
|
| gptkbp:enables |
smaller transistor sizes
|
| gptkbp:enhances |
resolution capabilities
|
| gptkbp:features |
dual-stage technology
|
| gptkbp:has |
multiple configurations
|
| gptkbp:hasCollaboratedWith |
research institutions
|
| gptkbp:hasEvents |
high yield rates
|
| https://www.w3.org/2000/01/rdf-schema#label |
TWINSCAN series
|
| gptkbp:improves |
wafer throughput
|
| gptkbp:includes |
gptkb:TWINSCAN_XT
TWINSCAN NXT |
| gptkbp:integration |
automation features
|
| gptkbp:introduced |
2000s
|
| gptkbp:isAvailableIn |
various manufacturing environments
|
| gptkbp:isAvenueFor |
emerging technologies.
|
| gptkbp:isChallengedBy |
lithography technology
|
| gptkbp:isCompatibleWith |
various photoresists
|
| gptkbp:isConnectedTo |
supply chain management systems
|
| gptkbp:isCriticizedFor |
chip scaling
|
| gptkbp:isDesignedFor |
meet future technology nodes
|
| gptkbp:isEnhancedBy |
AI and machine learning technologies
real-time monitoring capabilities |
| gptkbp:isEquippedWith |
advanced metrology tools
|
| gptkbp:isEvaluatedBy |
performance metrics
cost efficiency |
| gptkbp:isInfluencedBy |
semiconductor industry advancements
|
| gptkbp:isIntegratedWith |
software solutions
smart factory concepts |
| gptkbp:isKnownFor |
high productivity
|
| gptkbp:isLinkedTo |
sustainability initiatives
|
| gptkbp:isMarketedAs |
high-end lithography solution
|
| gptkbp:isOptimizedFor |
high throughput
|
| gptkbp:isPartOf |
gptkb:ASML's_lithography_systems
global semiconductor ecosystem ASML's_innovation_strategy ASML's_product_portfolio |
| gptkbp:isPromotedThrough |
industry conferences
|
| gptkbp:isRecognizedBy |
industry awards
|
| gptkbp:isRecognizedFor |
industry standard
|
| gptkbp:isSubjectTo |
regulatory standards
continuous innovation |
| gptkbp:isSupportedBy |
technical documentation
global service network customer training programs |
| gptkbp:isTestedFor |
reliability and performance
|
| gptkbp:isTrainedIn |
advanced lithography techniques
|
| gptkbp:isUsedBy |
leading semiconductor manufacturers
|
| gptkbp:isUtilizedFor |
advanced packaging technologies
|
| gptkbp:isUtilizedIn |
automotive semiconductor production
3D_NAND_fabrication |
| gptkbp:isVisitedBy |
logic and memory devices
|
| gptkbp:offers |
high precision alignment
|
| gptkbp:producedBy |
gptkb:ASML
|
| gptkbp:provides |
improved overlay accuracy
|
| gptkbp:reduces |
cost of ownership
|
| gptkbp:suitableFor |
extreme ultraviolet lithography (EUV)
|
| gptkbp:supports |
multiple patterning techniques
high volume manufacturing |
| gptkbp:usedIn |
semiconductor manufacturing
|
| gptkbp:utilizes |
high numerical aperture optics
|