Statements (57)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:Company
|
| gptkbp:bfsLayer |
6
|
| gptkbp:bfsParent |
gptkb:AMD_Ryzen_architecture
gptkb:AMD_Ryzen_processor_family |
| gptkbp:competes_with |
gptkb:Global_Foundries_14nm_process
Samsung 14nm process |
| gptkbp:developed_by |
gptkb:TSMC
|
| gptkbp:enables |
advanced packaging technologies
high-density designs |
| gptkbp:features |
gptkb:financial_services_company
|
| gptkbp:has |
sustainability practices
high customer satisfaction continuous improvement initiatives strong industry partnerships global customer base robust ecosystem high yield rates significant R& D investment advanced EDA tools comprehensive IP portfolio extensive design support extensive manufacturing capacity multiple foundry partners strong market demand |
| gptkbp:has_achievements |
20% performance improvement over 20nm
30% power reduction over 20nm up to 2.5 G Hz clock speed |
| https://www.w3.org/2000/01/rdf-schema#label |
TSMC 14nm process
|
| gptkbp:introduced |
gptkb:2014
|
| gptkbp:is |
cost-effective
scalable widely adopted environmentally friendly highly reliable used in consumer electronics used in automotive applications used in networking equipment used in Io T devices part of TSMC's technology roadmap used in AI accelerators |
| gptkbp:is_used_by |
gptkb:Qualcomm
gptkb:DJ gptkb:AMD gptkb:TV_Show |
| gptkbp:manufacturer |
gptkb:microprocessor
graphics processors system on chips (So Cs) |
| gptkbp:offers |
lower power consumption
higher performance |
| gptkbp:predecessor |
gptkb:TSMC_10nm_process
|
| gptkbp:successor |
TSMC 20nm process
|
| gptkbp:supports |
RF applications
multiple voltage domains high-speed I/ O |
| gptkbp:used_in |
gptkb:smartphone
laptops tablets |