gptkbp:instance_of
|
gptkb:microprocessor
|
gptkbp:architecture
|
gptkb:SPARC_V9
|
gptkbp:cache_size
|
64 bytes
up to 64 MB
multi-level cache
up to 16-way
|
gptkbp:compatibility
|
gptkb:Linux
|
gptkbp:connects
|
CMT (Chip Multithreading)
|
gptkbp:designed_by
|
gptkb:Oracle_Corporation
|
gptkbp:designed_for
|
gptkb:cloud_computing
|
gptkbp:designed_for_workloads
|
mission-critical workloads
|
gptkbp:error_handling
|
ECC memory support
|
gptkbp:features
|
hardware security features
|
gptkbp:form_factor
|
multi-chip module
|
gptkbp:graphics
|
no
|
gptkbp:has_units
|
yes
|
https://www.w3.org/2000/01/rdf-schema#label
|
SPARC M9
|
gptkbp:instruction_set
|
gptkb:SPARC_V9
high
|
gptkbp:is_compatible_with
|
gptkb:Oracle_Solaris
|
gptkbp:manufacturer
|
gptkb:TSMC
|
gptkbp:manufacturing_process
|
16 nm
|
gptkbp:market_segment
|
enterprise servers
|
gptkbp:memory_type
|
DDR4
|
gptkbp:number_of_cores
|
8
up to 32
|
gptkbp:performance
|
high performance computing
|
gptkbp:power_consumption
|
up to 200 W
|
gptkbp:ram
|
up to 4 TB
up to 128 GB/s
|
gptkbp:release_date
|
gptkb:2017
|
gptkbp:released_in
|
gptkb:2017
|
gptkbp:security_features
|
secure boot
|
gptkbp:socket_type
|
SPARC M9 socket
|
gptkbp:successor
|
gptkb:SPARC_M10
|
gptkbp:supports
|
high throughput applications
|
gptkbp:supports_hypervisors
|
gptkb:KVM
|
gptkbp:system
|
big data analytics
|
gptkbp:thermal_design_power
|
TDP 200 W
|
gptkbp:used_in
|
data centers
|
gptkbp:used_in_industries
|
gptkb:education
gptkb:Telecommunications
gptkb:government
gptkb:financial_services
healthcare
energy
manufacturing
retail
|
gptkbp:uses
|
gptkb:RISC_architecture
|
gptkbp:virtualization_support
|
gptkb:Oracle_VM_Server_for_SPARC
gptkb:true
|
gptkbp:bfsParent
|
gptkb:SPARC_M8
gptkb:Sun_SPARC_architecture
gptkb:SPARC_Architecture
|
gptkbp:bfsLayer
|
6
|