gptkbp:instance_of
|
gptkb:Company
|
gptkbp:bfsLayer
|
5
|
gptkbp:bfsParent
|
gptkb:Sound_Blaster_FURY
gptkb:Sound_Blaster_Play!_3_Plus
|
gptkbp:application
|
gptkb:Io_T_devices
|
gptkbp:architectural_style
|
gptkb:architect
|
gptkbp:average_temperature
|
-40 to 85 degrees Celsius
|
gptkbp:cooling_system
|
advanced thermal management
|
gptkbp:data_usage
|
up to 10 Gbps
|
gptkbp:designed_by
|
gptkb:SB_Corporation
|
gptkbp:developer
|
high development cost
|
gptkbp:dimensions
|
5mm x 5mm
|
gptkbp:enables
|
smart home integration
augmented reality experiences
|
gptkbp:enhances
|
gaming performance
|
gptkbp:features
|
low latency performance
multi-core processing
high-speed connectivity
AI processing capabilities
|
gptkbp:form_factor
|
system on chip (So C)
|
https://www.w3.org/2000/01/rdf-schema#label
|
SB-Axx1 chip
|
gptkbp:includes
|
gptkb:software
integrated modem
AI accelerator
|
gptkbp:input_output
|
1.0 to 1.2 volts
|
gptkbp:integrates_with
|
gptkb:Graphics_Processing_Unit
|
gptkbp:is_compatible_with
|
gptkb:operating_system
|
gptkbp:is_designed_for
|
high-end smartphones
mobile gaming
|
gptkbp:manufacturer
|
gptkb:SB_Corporation
|
gptkbp:market_segment
|
consumer electronics
|
gptkbp:offers
|
enhanced security features
customizable performance settings
|
gptkbp:packaging
|
BGA
|
gptkbp:performance
|
high performance
high efficiency
|
gptkbp:power_consumption
|
low power consumption
|
gptkbp:produced_by
|
high production volume
|
gptkbp:provides
|
image processing capabilities
high bandwidth memory
enhanced audio processing
fast charging capabilities
|
gptkbp:ram
|
LPDD R5
|
gptkbp:release_date
|
March 2023
|
gptkbp:released_in
|
gptkb:2023
|
gptkbp:supports
|
gptkb:financial_services_company
gptkb:Bluetooth_5.0
machine learning applications
wireless charging
high-resolution displays
dual SIM functionality
multi-camera setups
edge computing.
cloud computing applications
5 G connectivity
4 K video playback
|
gptkbp:target_market
|
gptkb:smartphone
|
gptkbp:used_in
|
gptkb:smartphone
|