Statements (56)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
technology
|
| gptkbp:appearsIn |
IoT devices
automotive applications smartphones tablets wearable technology |
| gptkbp:benefits |
scalability
cost-effectiveness integration with digital circuits |
| gptkbp:characterizedBy |
low power consumption
high linearity high integration density wide bandwidth |
| gptkbp:competesWith |
GaAs technology
SiGe technology BiCMOS technology FD-SOI_technology |
| gptkbp:developedBy |
semiconductor industry
|
| gptkbp:enables |
high-speed data transmission
multi-band operation high-frequency operation low-voltage operation |
| gptkbp:faced |
temperature sensitivity
power supply variations noise performance linearity issues |
| https://www.w3.org/2000/01/rdf-schema#label |
RF CMOS
|
| gptkbp:includes |
oscillators
mixers transmitters receivers |
| gptkbp:integratesWith |
analog components
RF components digital components mixed-signal components |
| gptkbp:isPartOf |
communication systems
signal processing units RF front-end modules transceiver systems |
| gptkbp:isUsedIn |
consumer electronics
industrial applications medical devices telecommunications equipment |
| gptkbp:isVisitedBy |
leading semiconductor companies
|
| gptkbp:researchFocus |
improving efficiency
reducing costs miniaturization enhancing performance |
| gptkbp:standardFeatures |
gptkb:ISO
IEEE IEC JEDEC |
| gptkbp:usedIn |
wireless communication
cellular networks satellite communication RFID_systems |