gptkbp:instance_of
|
gptkb:microprocessor
|
gptkbp:bfsLayer
|
6
|
gptkbp:bfsParent
|
gptkb:Qualcomm_Snapdragon_8cx_Gen_2
|
gptkbp:architectural_style
|
gptkb:CEO
|
gptkbp:battery_life
|
up to 25 hours
|
gptkbp:communication
|
gptkb:Snapdragon_X55
gptkb:Snapdragon_X62
|
gptkbp:competitors
|
gptkb:microprocessor
gptkb:Intel_Core_i7
gptkb:Apple_M1
Microsoft S Q3
|
gptkbp:connects
|
gptkb:5_G
gptkb:Wi-Fi_6_E
Bluetooth 5.1
|
gptkbp:cooling_system
|
advanced thermal management
|
gptkbp:developer
|
strong developer support
|
gptkbp:ecosystem
|
growing ecosystem
|
gptkbp:events
|
Qualcomm Tech Summit 2021
|
gptkbp:focuses_on
|
thin and light devices
|
gptkbp:fuel_capacity
|
high power efficiency
|
gptkbp:gpu
|
gptkb:Adreno_690
|
https://www.w3.org/2000/01/rdf-schema#label
|
Qualcomm Snapdragon 8cx Gen 3
|
gptkbp:intelligence
|
gptkb:Qualcomm_AI_Engine
up to 3x better than previous generation
|
gptkbp:is_compatible_with
|
x86 applications
ARM applications
|
gptkbp:manufacturer
|
gptkb:Qualcomm
|
gptkbp:market
|
premium segment
|
gptkbp:performance
|
high performance
up to 60% better than previous generation
high performance benchmarks
|
gptkbp:processor
|
gptkb:Octa-core_Kryo_495
|
gptkbp:produced_by
|
5 nm
|
gptkbp:ram
|
32 GB
LPDD R4x
|
gptkbp:release_date
|
December 2021
|
gptkbp:security_features
|
gptkb:Windows_Hello
|
gptkbp:sound
|
gptkb:Qualcomm_apt_X
gptkb:Dolby_Atmos
|
gptkbp:storage
|
2 TB
|
gptkbp:successor
|
Qualcomm Snapdragon 8cx Gen 4
|
gptkbp:supports
|
gptkb:operating_system
gptkb:Windows_11
5 G connectivity
|
gptkbp:target_market
|
Laptops
2-in-1 devices
|
gptkbp:thermal_design_power
|
7 W
|
gptkbp:user_base
|
gptkb:University
business professionals
gamers
creators
|
gptkbp:user_experience
|
enhanced user experience
|
gptkbp:video_output
|
gptkb:HEVC
4 KHDR
A V1
|