gptkbp:instance_of
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gptkb:microprocessor
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gptkbp:application
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gptkb:networking
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gptkbp:architecture
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gptkb:Power_PC
RISC
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gptkbp:average_temperature
|
0 to 85 ° C
|
gptkbp:bus_connections
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gptkb:transportation
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gptkbp:cache_size
|
32 bytes
512 KB L2 cache
write-back cache
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gptkbp:clock_speed
|
up to 1.5 GHz
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gptkbp:compatibility
|
Power PC 603 and 604
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gptkbp:debugging_support
|
JTAG
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gptkbp:design_features
|
multi-threading support
|
gptkbp:design_philosophy
|
balance of performance and efficiency
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gptkbp:design_purpose
|
high performance and low power
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gptkbp:designed_by
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gptkb:IBM
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gptkbp:development_tools
|
IBM's XLC compiler
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gptkbp:die_size
|
gptkb:unknown
|
gptkbp:end_of_life
|
gptkb:2007
shift in market demand
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gptkbp:features
|
dual issue
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gptkbp:first_introduced
|
gptkb:2001
|
gptkbp:has_units
|
integrated FPU
|
gptkbp:history
|
part of the Power PC family
|
https://www.w3.org/2000/01/rdf-schema#label
|
Power PC 8640
|
gptkbp:input_output
|
1.2 V
|
gptkbp:instruction_set
|
gptkb:Power_ISA
gptkb:Power_PC_architecture
|
gptkbp:integration
|
integrated memory controller
|
gptkbp:involved_technology
|
gptkb:Power_PC_750
|
gptkbp:legacy
|
gptkb:Power_PC_601
limited support for older Power PC software
|
gptkbp:manufacturer
|
45 nm process
|
gptkbp:market_launch
|
gptkb:2001
|
gptkbp:market_position
|
high-end embedded processor
|
gptkbp:market_segment
|
gptkb:Telecommunications
|
gptkbp:memory_type
|
gptkb:SDRAM
harvard architecture
|
gptkbp:notable_users
|
gptkb:Cisco_Systems
|
gptkbp:number_of_cores
|
gptkb:1
|
gptkbp:number_of_games
|
256 pins
|
gptkbp:packaging
|
FCBGA
|
gptkbp:performance
|
gptkb:SPECint
high performance computing
competes with ARM processors
|
gptkbp:power_consumption
|
low power
|
gptkbp:primary_use
|
industrial applications
|
gptkbp:production_status
|
discontinued
|
gptkbp:ram
|
yes
|
gptkbp:related_products
|
gptkb:Power_PC_860
|
gptkbp:released
|
gptkb:2001
|
gptkbp:security_features
|
no specific security features
|
gptkbp:successor
|
gptkb:Power_PC_970
Power PC 8641
|
gptkbp:supports
|
SIMD instructions
|
gptkbp:target_market
|
embedded applications
|
gptkbp:thermal_design_power
|
up to 25 W
|
gptkbp:used_in
|
embedded systems
|
gptkbp:bfsParent
|
gptkb:Power_PC_8540
|
gptkbp:bfsLayer
|
6
|