Statements (28)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
hardware specification
|
| gptkbp:abbreviation |
gptkb:OAM
|
| gptkbp:announced |
2019
|
| gptkbp:connectorType |
high-speed edge connector
|
| gptkbp:coolingSystem |
direct liquid cooling
air cooling |
| gptkbp:developedBy |
gptkb:Open_Compute_Project
|
| gptkbp:enables |
high-density accelerator deployment
|
| gptkbp:formFactor |
mezzanine card
|
| gptkbp:hasVersion |
OAM 1.0
OAM 2.0 |
| https://www.w3.org/2000/01/rdf-schema#label |
OCP Accelerator Module
|
| gptkbp:powerSource |
up to 700W
|
| gptkbp:purpose |
standardize accelerator hardware form factor
|
| gptkbp:relatedStandard |
gptkb:OCP_NIC
gptkb:OCP_Open_Rack gptkb:Open_Compute_Project |
| gptkbp:supports |
GPUs
FPGAs custom ASICs |
| gptkbp:usedFor |
gptkb:machine_learning
high-performance computing AI workloads |
| gptkbp:usedIn |
data centers
OCP servers |
| gptkbp:bfsParent |
gptkb:OpenCAPI_Consortium
gptkb:Open_Compute_Project |
| gptkbp:bfsLayer |
7
|