|
gptkbp:instanceOf
|
gptkb:microprocessor
|
|
gptkbp:application
|
AI workloads
|
|
gptkbp:architect
|
ARMv8-A
|
|
gptkbp:compatibleWith
|
Linux
|
|
gptkbp:coolingSystem
|
up to 200W
|
|
gptkbp:designedBy
|
gptkb:Arm_Holdings
|
|
gptkbp:ecosystem
|
Arm ecosystem
|
|
gptkbp:energyEfficiency
|
high power efficiency
|
|
gptkbp:hasAwards
|
up to 128 cores
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Neoverse E1
|
|
gptkbp:instructionSet
|
AArch64
|
|
gptkbp:interagencyCooperation
|
CCIX
|
|
gptkbp:is_a_resource_for
|
gptkb:LINPACK
gptkb:SPEC_CPU_2017
Geekbench 5
|
|
gptkbp:isSupportedBy
|
yes
KVM
|
|
gptkbp:keyEvent
|
Arm TechCon 2019
|
|
gptkbp:marketSegment
|
data centers
|
|
gptkbp:partnerships
|
gptkb:Marvell
gptkb:Mitsubishi_Electric
gptkb:IBM
gptkb:Oracle
gptkb:Sony
gptkb:Hitachi
gptkb:Nokia
gptkb:Samsung_Electronics
gptkb:Cisco
gptkb:Dell_Technologies
gptkb:ZTE
gptkb:Fujitsu
gptkb:LG_Electronics
gptkb:Lenovo
gptkb:NEC
gptkb:Huawei_Cloud
gptkb:HPE
NVIDIA
Ericsson
Qualcomm
Alibaba Cloud
Tencent Cloud
Broadcom
|
|
gptkbp:performance
|
high performance
up to 3.0 GHz
high scalability
|
|
gptkbp:productionCompany
|
7nm
|
|
gptkbp:RAM
|
DDR4
up to 32MB L3 cache
|
|
gptkbp:relatedPatent
|
edge computing
|
|
gptkbp:releaseYear
|
2020
|
|
gptkbp:security
|
TrustZone
|
|
gptkbp:servicesProvided
|
gptkb:Microsoft_Azure
gptkb:Amazon_Web_Services
gptkb:Google_Cloud_Platform
|
|
gptkbp:successor
|
Neoverse N1
|
|
gptkbp:supports
|
virtualization
|
|
gptkbp:targetMarket
|
cloud computing
|