gptkbp:instance_of
|
gptkb:microprocessor
|
gptkbp:application
|
big data analytics
AI and machine learning
|
gptkbp:architecture
|
gptkb:Arm_architecture
|
gptkbp:cache_size
|
up to 32 MB L3 cache
multi-level cache hierarchy
|
gptkbp:cloud_native_support
|
cloud-native applications
|
gptkbp:collaboration
|
various cloud providers
|
gptkbp:competes_with
|
gptkb:Intel_Xeon
|
gptkbp:connects
|
CCIX
|
gptkbp:customer_base
|
diverse customer base
|
gptkbp:data_usage
|
high data throughput
|
gptkbp:designed_by
|
gptkb:Arm_Holdings
|
gptkbp:development_tools
|
Arm development tools
|
gptkbp:ecosystem
|
growing ecosystem of partners
growing software ecosystem
|
gptkbp:enhancements_over
|
previous Neoverse designs
|
gptkbp:fuel_economy
|
high power efficiency
designed for energy efficiency
|
https://www.w3.org/2000/01/rdf-schema#label
|
Neoverse E1
|
gptkbp:instruction_set
|
gptkb:AArch64
|
gptkbp:integrates_with
|
AI accelerators
|
gptkbp:is_compatible_with
|
gptkb:Neoverse_N1
|
gptkbp:is_scalable
|
high scalability
|
gptkbp:is_targeted_at
|
service providers
|
gptkbp:launch_event
|
gptkb:Arm_Tech_Con_2019
|
gptkbp:manufacturing_process
|
7nm process technology
|
gptkbp:market_launch
|
2020 market launch
|
gptkbp:market_segment
|
enterprise applications
|
gptkbp:memory_type
|
gptkb:DDR4_memory
|
gptkbp:network
|
advanced networking capabilities
|
gptkbp:number_of_cores
|
up to 128 cores
|
gptkbp:part_of
|
Neoverse family
|
gptkbp:partnerships
|
strategic partnerships with tech companies
|
gptkbp:performance
|
high performance
low latency
high performance metrics
competitive benchmark results
|
gptkbp:platforms
|
supports containerization
|
gptkbp:power_consumption
|
optimized for performance per watt
|
gptkbp:project
|
future developments planned
|
gptkbp:provides_support_for
|
Linux operating systems
|
gptkbp:reach
|
global reach in markets
|
gptkbp:release_year
|
gptkb:2020
|
gptkbp:security_features
|
hardware security features
|
gptkbp:support
|
virtualization
5 G applications
|
gptkbp:target_market
|
gptkb:cloud_computing
|
gptkbp:thermal_design_power
|
up to 200 W
|
gptkbp:use_case
|
edge computing
|
gptkbp:used_in
|
data centers
|
gptkbp:virtualization_support
|
gptkb:Java_Virtual_Machine
|
gptkbp:bfsParent
|
gptkb:ARM_Neoverse
|
gptkbp:bfsLayer
|
5
|