MIL-STD-810G durability

GPTKB entity

Statements (66)
Predicate Object
gptkbp:instanceOf gptkb:standard
gptkbp:appliesTo gptkb:aircraft
commercial products
gptkbp:hasSection Test Method 500.5 Low Pressure (Altitude)
Test Method 501.5 High Temperature
Test Method 502.5 Low Temperature
Test Method 503.5 Temperature Shock
Test Method 504.1 Contamination by Fluids
Test Method 505.5 Solar Radiation (Sunshine)
Test Method 506.5 Rain
Test Method 507.5 Humidity
Test Method 508.6 Fungus
Test Method 509.5 Salt Fog
Test Method 510.5 Sand and Dust
Test Method 511.5 Explosive Atmosphere
Test Method 512.5 Immersion
Test Method 513.6 Acceleration
Test Method 514.6 Vibration
Test Method 515.6 Acoustic Noise
Test Method 516.6 Shock
Test Method 517.1 Pyroshock
Test Method 518.1 Acidic Atmosphere
Test Method 519.6 Gunfire Vibration
Test Method 521.3 Icing/Freezing Rain
Test Method 522.1 Ballistic Shock
Test Method 523.3 Vibro-Acoustic/Temperature
Test Method 524.1 Freeze/Thaw
Test Method 525.1 Time Waveform Replication
Test Method 520.3 Temperature, Humidity, Vibration, and Altitude
https://www.w3.org/2000/01/rdf-schema#label MIL-STD-810G durability
gptkbp:partOf gptkb:MIL-STD-810G
gptkbp:precededBy gptkb:MIL-STD-810H
MIL-STD-810H Change 1
gptkbp:publishedBy gptkb:United_States_Department_of_Defense
gptkbp:publishedIn 2008
gptkbp:relatedTo laboratory tests
environmental engineering considerations
gptkbp:replacedBy gptkb:MIL-STD-810H
gptkbp:testedBy solar radiation
rain
water resistance
acceleration
low pressure
high temperature
immersion
icing
leakage
low temperature
altitude resistance
explosive atmosphere
freezing rain
gunfire vibration
humidity resistance
salt fog resistance
temperature extremes
vibration resistance
shock resistance
blowing dust
blowing sand
sand and dust resistance
fungus resistance
gptkbp:usedBy gptkb:United_States_Department_of_Defense
electronics manufacturers
rugged device manufacturers
gptkbp:bfsParent gptkb:Lenovo_ThinkPad_X1_Carbon
gptkbp:bfsLayer 5