gptkbp:instance_of
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gptkb:memory
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gptkbp:application
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Consumer electronics
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gptkbp:capacity
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up to 8 GB
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gptkbp:chip_density
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Higher density chips available
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gptkbp:competitors
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Competes with LPDDR4
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gptkbp:data_usage
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1600 MT/s
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gptkbp:design_purpose
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Maximize performance while minimizing power
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gptkbp:designed_for
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Mobile devices
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gptkbp:developed_by
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gptkb:JEDEC
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gptkbp:features
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Low power consumption
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gptkbp:form_factor
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gptkb:BGA_(Ball_Grid_Array)
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gptkbp:fuel_economy
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Improved over previous generations
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https://www.w3.org/2000/01/rdf-schema#label
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LPDDR3 RAM
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gptkbp:input_output
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1.2 V
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gptkbp:interface
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Mobile DDR interface
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gptkbp:introduced_in
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gptkb:2012
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gptkbp:is_compatible_with
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gptkb:LPDDR2_RAM
LPDDR4 RAM
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gptkbp:is_scalable
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Scalable to higher capacities
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gptkbp:is_standardized_by
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JEDEC standard
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gptkbp:manufacturer
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Various manufacturers
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gptkbp:manufacturing_process
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20 nm technology
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gptkbp:market_segment
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Mobile computing
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gptkbp:memory_cell
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1 T1 C cell structure
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gptkbp:memory_density
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Higher than LPDDR2
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gptkbp:memory_type
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Random access
Integrated memory controller
Synchronous DRAM
Dynamic random-access memory
Wide I/ O interface
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gptkbp:performance
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Data transfer rate
Lower than LPDDR2
Higher than LPDDR2
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gptkbp:power_consumption
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Lower than DDR3
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gptkbp:predecessor
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LPDDR4 RAM
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gptkbp:ram
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12.8 GB/s
1600 MHz
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gptkbp:successor
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gptkb:LPDDR2_RAM
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gptkbp:supply_chain
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Global supply chain
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gptkbp:supports
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Dual-channel architecture
Single-channel architecture
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gptkbp:thermal_design_power
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Optimized for mobile use
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gptkbp:used_in
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gptkb:Io_T_devices
gptkb:smartphone
Laptops
Tablets
Wearable devices
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gptkbp:uses_technology
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Widely adopted
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gptkbp:bfsParent
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gptkb:Qualcomm_Snapdragon_200_Plus
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gptkbp:bfsLayer
|
5
|