LGA (Land Grid Array) packaging
GPTKB entity
Statements (60)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:packaging
|
| gptkbp:allows |
high pin count
|
| gptkbp:benefits |
PGA (Pin Grid Array) packaging
|
| gptkbp:developed_by |
gptkb:Intel
|
| gptkbp:enables |
better signal integrity
|
| gptkbp:facilitates |
automated assembly
|
| gptkbp:features |
flat surface
|
| https://www.w3.org/2000/01/rdf-schema#label |
LGA (Land Grid Array) packaging
|
| gptkbp:is_a_choice_for |
cloud computing solutions
custom PC builds |
| gptkbp:is_a_key_component_of |
motherboard design
|
| gptkbp:is_a_solution_for |
thermal management
high-frequency applications high-density interconnections |
| gptkbp:is_associated_with |
lower manufacturing costs
|
| gptkbp:is_available_in |
various sizes
|
| gptkbp:is_characterized_by |
array of pads
|
| gptkbp:is_compatible_with |
various chipsets
socketed motherboards |
| gptkbp:is_designed_for |
high-performance computing
|
| gptkbp:is_designed_to |
maximize space efficiency
reduce footprint |
| gptkbp:is_favored_by |
data centers
|
| gptkbp:is_known_for |
modular design
high reliability flexibility in design enhanced connectivity low profile design ease of assembly |
| gptkbp:is_often_compared_to |
BGA (Ball Grid Array) packaging
|
| gptkbp:is_often_used_in |
gptkb:microprocessor
|
| gptkbp:is_part_of |
advanced semiconductor technology
high-speed computing solutions modern CPU architecture next-generation computing technology |
| gptkbp:is_recommended_for |
high-density applications
|
| gptkbp:is_standardized_by |
high-performance CPUs
|
| gptkbp:is_used_for |
embedded systems
|
| gptkbp:is_used_in |
gptkb:Telecommunications
gptkb:networking gptkb:smart_home_devices gptkb:medical_devices automotive applications consumer electronics graphics cards virtual reality systems AI accelerators robotics systems server processors |
| gptkbp:is_utilized_by |
gptkb:AMD
|
| gptkbp:is_utilized_in |
gaming consoles
|
| gptkbp:manufacturer |
surface mount technology
|
| gptkbp:provides |
better thermal performance
|
| gptkbp:reduces |
risk of bent pins
|
| gptkbp:supports |
multiple power delivery options
|
| gptkbp:type_of |
gptkb:road
surface mount package |
| gptkbp:used_in |
gptkb:smart_home_devices
|
| gptkbp:bfsParent |
gptkb:SPARC_T2_socket
|
| gptkbp:bfsLayer |
6
|