LGA (Land Grid Array) packaging
GPTKB entity
Statements (60)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:software
|
| gptkbp:allows |
high pin count
|
| gptkbp:benefits |
PGA (Pin Grid Array) packaging
|
| gptkbp:developed_by |
gptkb:Intel
|
| gptkbp:enables |
better signal integrity
|
| gptkbp:facilitates |
automated assembly
|
| gptkbp:features |
flat surface
|
| https://www.w3.org/2000/01/rdf-schema#label |
LGA (Land Grid Array) packaging
|
| gptkbp:is_a_solution_for |
thermal management
high-frequency applications high-density interconnections |
| gptkbp:is_associated_with |
lower manufacturing costs
|
| gptkbp:is_available_in |
various sizes
|
| gptkbp:is_characterized_by |
array of pads
|
| gptkbp:is_compatible_with |
various chipsets
socketed motherboards |
| gptkbp:is_considered |
cloud computing solutions
custom PC builds |
| gptkbp:is_designed_for |
high-performance computing
|
| gptkbp:is_designed_to |
maximize space efficiency
reduce footprint |
| gptkbp:is_known_for |
modular design
high reliability flexibility in design enhanced connectivity low profile design ease of assembly |
| gptkbp:is_often_compared_to |
BGA (Ball Grid Array) packaging
|
| gptkbp:is_often_used_in |
gptkb:microprocessor
|
| gptkbp:is_part_of |
advanced semiconductor technology
high-speed computing solutions modern CPU architecture next-generation computing technology |
| gptkbp:is_standardized_by |
high-performance CP Us
|
| gptkbp:is_used_for |
embedded systems
|
| gptkbp:is_used_in |
gptkb:hospital
gptkb:XMPP_Extension_Protocol gptkb:computer gptkb:Telecommunications_company automotive applications consumer electronics graphics cards virtual reality systems AI accelerators robotics systems server processors |
| gptkbp:is_utilized_in |
gptkb:AMD
gaming consoles |
| gptkbp:key |
motherboard design
|
| gptkbp:manufacturer |
surface mount technology
|
| gptkbp:provides |
better thermal performance
|
| gptkbp:reduces |
risk of bent pins
|
| gptkbp:suitable_for |
data centers
high-density applications |
| gptkbp:supports |
multiple power delivery options
|
| gptkbp:type_of |
gptkb:microprocessor
surface mount package |
| gptkbp:used_in |
gptkb:hospital
|
| gptkbp:bfsParent |
gptkb:SPARC_T2_socket
|
| gptkbp:bfsLayer |
6
|