Statements (20)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:International_Standard
|
| gptkbp:appliesTo |
semiconductor packages
|
| gptkbp:category |
electronic component packaging standard
|
| gptkbp:documentType |
mechanical outline
|
| gptkbp:feature |
surface-mount
leadless package exposed pad |
| gptkbp:firstPublished |
2004
|
| gptkbp:fullName |
JEDEC Outline MO-220
|
| https://www.w3.org/2000/01/rdf-schema#label |
JEDEC MO-220
|
| gptkbp:relatedStandard |
JEDEC MO-153
JEDEC MO-229 |
| gptkbp:shape |
rectangular
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:type |
gptkb:Quad_Flat_No-lead
surface-mount QFN |
| gptkbp:usedFor |
integrated circuits
|
| gptkbp:bfsParent |
gptkb:QFN32
|
| gptkbp:bfsLayer |
6
|