Statements (17)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:company
|
| gptkbp:country |
gptkb:United_States
|
| gptkbp:foundedBy |
gptkb:Xperi
|
| https://www.w3.org/2000/01/rdf-schema#label |
Invensas
|
| gptkbp:industry |
semiconductors
|
| gptkbp:location |
gptkb:San_Jose,_California
|
| gptkbp:offersTechnology |
BVA (Bond Via Array)
DBI (Direct Bond Interconnect) ZiBond |
| gptkbp:parentCompany |
gptkb:Xperi
|
| gptkbp:specializesIn |
semiconductor packaging
3D integration advanced interconnect technologies |
| gptkbp:website |
https://www.invensas.com/
|
| gptkbp:bfsParent |
gptkb:Xperi_Corporation
gptkb:Xperi_Holding_Corporation |
| gptkbp:bfsLayer |
7
|