|
gptkbp:instanceOf
|
microarchitecture
|
|
gptkbp:architect
|
64-bit
|
|
gptkbp:audioJack
|
gptkb:Intel_HD_Audio
|
|
gptkbp:code
|
gptkb:Kaby_Lake
|
|
gptkbp:compatibleWith
|
gptkb:Intel_200_series
|
|
gptkbp:component
|
available in mobile variants
|
|
gptkbp:coolingSystem
|
varies by model
|
|
gptkbp:customerBase
|
LGA 1151
|
|
gptkbp:developedBy
|
gptkb:Intel_Corporation
|
|
gptkbp:drawings
|
3.0
DirectX 12
Gen 9
|
|
gptkbp:energyEfficiency
|
enhanced
|
|
gptkbp:environmentalImpact
|
supported
|
|
gptkbp:hasAwards
|
up to 4
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Intel Kaby Lake
|
|
gptkbp:is_integrated_with
|
gptkb:Intel_HD_Graphics_630
|
|
gptkbp:isSupportedBy
|
gptkb:Intel_VT-x
|
|
gptkbp:keyEvent
|
CES 2017
|
|
gptkbp:launchVehicle
|
Core_i3,_i5,_i7
|
|
gptkbp:market
|
2017
|
|
gptkbp:marketSegment
|
consumer electronics
|
|
gptkbp:musicVideo
|
4K UHD
|
|
gptkbp:numberOfTeams
|
up to 8
|
|
gptkbp:offers
|
varies by model
|
|
gptkbp:overclockingSupport
|
available on unlocked models
|
|
gptkbp:performance
|
high-performance computing
compared to Skylake
|
|
gptkbp:powers
|
optimized for low power
|
|
gptkbp:predecessor
|
gptkb:Intel_Broadwell
|
|
gptkbp:productionCompany
|
14 nm
|
|
gptkbp:RAM
|
DDR4
up to 25.6 GB/s
varies by model
up to 8MB
|
|
gptkbp:released
|
improved media capabilities
|
|
gptkbp:releaseDate
|
January 2017
|
|
gptkbp:security
|
gptkb:Intel_SGX
|
|
gptkbp:streamingPlatforms
|
HEVC 10-bit
|
|
gptkbp:style
|
improved over previous generations
|
|
gptkbp:successor
|
gptkb:Intel_Skylake
|
|
gptkbp:supported
|
802.11ac
|
|
gptkbp:supportedBy
|
4.2
3.1
|
|
gptkbp:supportRole
|
3
|
|
gptkbp:targetMarket
|
desktop and mobile devices
|
|
gptkbp:TDP
|
up to 95W
|
|
gptkbp:userDemographics
|
up to 64GB
|