gptkbp:instance_of
|
gptkb:microprocessor
|
gptkbp:bfsLayer
|
5
|
gptkbp:bfsParent
|
gptkb:Intel_Advanced_Vector_Extensions_512
|
gptkbp:application
|
gptkb:software_framework
gptkb:Cloud_Computing_Service
big data
high-performance computing
|
gptkbp:architectural_style
|
x86-64
|
gptkbp:avionics
|
supported
|
gptkbp:cache_size
|
up to 38.5 MB
multi-level cache
|
gptkbp:competitors
|
AMDEPYC
|
gptkbp:events
|
Intel Architecture Day 2019
|
gptkbp:features
|
gptkb:Intel_Deep_Learning_Boost
gptkb:Intel_Optane_DC_Persistent_Memory
|
gptkbp:form_factor
|
gptkb:server
|
gptkbp:fuel_capacity
|
improved over Skylake
|
gptkbp:gpu
|
PC Ie 3.0
|
gptkbp:graphics
|
gptkb:none
|
https://www.w3.org/2000/01/rdf-schema#label
|
Intel Cascade Lake processors
|
gptkbp:hyper_threading
|
gptkb:112
supported
|
gptkbp:is_compatible_with
|
gptkb:operating_system
gptkb:server
|
gptkbp:is_scalable
|
up to 8 sockets
|
gptkbp:language_of_instruction
|
x86-64
|
gptkbp:launch_vehicle
|
gptkb:Cascade_Lake
|
gptkbp:manufacturer
|
gptkb:Intel_Corporation
|
gptkbp:market
|
gptkb:2019
varies by model
|
gptkbp:market_segment
|
high-performance computing
|
gptkbp:number_of_cores
|
56
|
gptkbp:open_glsupport
|
supported
|
gptkbp:overclocking_support
|
not supported
|
gptkbp:performance
|
gptkb:Turbo_Boost_Technology_2.0
optimized for AI workloads
|
gptkbp:power_consumption
|
gptkb:Intel_Speed_Step
|
gptkbp:predecessor
|
gptkb:Intel_Skylake
|
gptkbp:produced_by
|
14 nm
|
gptkbp:product_line
|
gptkb:Xeon_Scalable
|
gptkbp:ram
|
up to 768 GB/s
4.5 TB
DD R4
DD R4-2933
up to 512 GB per DIMM
|
gptkbp:release_date
|
April 2019
|
gptkbp:security_features
|
gptkb:Intel_TXT
gptkb:Intel_SGX
|
gptkbp:sister_channel
|
gptkb:6
|
gptkbp:socket_type
|
LGA 3647
|
gptkbp:successor
|
gptkb:Intel_Cooper_Lake
|
gptkbp:supports
|
gptkb:Intel_Processor_Trace
|
gptkbp:target_market
|
data centers
|
gptkbp:tdp
|
up to 205 W
|
gptkbp:thermal_design_power
|
varies by model
|
gptkbp:virtualization_support
|
gptkb:Intel_VT-d
gptkb:Intel_VT-x
|