Statements (28)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:Company
|
| gptkbp:associated_with |
Intel's_IDM_2.0_strategy
|
| gptkbp:compatibleWith |
DDR5 memory
PCIe 5.0 |
| gptkbp:competesWith |
gptkb:AMD_Zen_3
|
| gptkbp:completed |
10nm technology node
|
| gptkbp:developedBy |
gptkb:Intel_Corporation
|
| gptkbp:enables |
better thermal performance
|
| gptkbp:features |
transistor density increase
|
| https://www.w3.org/2000/01/rdf-schema#label |
Intel 7 process
|
| gptkbp:improves |
performance
power efficiency clock_speeds |
| gptkbp:introduced |
2021
|
| gptkbp:is_designed_to |
mobile and desktop CPUs
|
| gptkbp:is_expected_to |
support future generations of processors
|
| gptkbp:is_known_for |
improved_IPC_(Instructions_Per_Cycle)
|
| gptkbp:is_part_of |
Intel's_process_technology_roadmap
Intel's_12th_generation_Core_lineup |
| gptkbp:is_used_in |
gptkb:Intel_Core_processors
|
| gptkbp:performance |
AI workloads
|
| gptkbp:predecessor |
Intel_14_process
|
| gptkbp:produces |
300mm wafers
|
| gptkbp:reduces |
die size
|
| gptkbp:successor |
Intel_10_process
|
| gptkbp:supports |
Alder_Lake_architecture
|
| gptkbp:targets |
high-performance computing
|
| gptkbp:uses |
EUV lithography
|