|
gptkbp:instanceOf
|
gptkb:microprocessor
|
|
gptkbp:announced
|
2020
|
|
gptkbp:architecture
|
gptkb:POWER_ISA_v3.1
|
|
gptkbp:coreCount
|
15
8
|
|
gptkbp:fabricationProcess
|
gptkb:Samsung_Electronics
|
|
gptkbp:frequency
|
4.0 GHz
|
|
gptkbp:L2Cache
|
120 MB shared
2 MB per core
48 KB instruction, 32 KB data per core
|
|
gptkbp:manufacturer
|
gptkb:IBM
|
|
gptkbp:predecessor
|
gptkb:IBM_Power9
|
|
gptkbp:processNode
|
7 nm
|
|
gptkbp:releaseDate
|
2021
|
|
gptkbp:size
|
602 mm²
|
|
gptkbp:successor
|
IBM Power11
|
|
gptkbp:supports
|
gptkb:AIX
gptkb:CAPI_2.0
gptkb:IBM_i
gptkb:OpenCAPI
gptkb:DDR5
gptkb:NVLink_4.0
gptkb:PCIe_5.0
gptkb:SMT8
gptkb:Linux
gptkb:PowerVM
gptkb:Simultaneous_Multithreading_(SMT)
gptkb:DDR4
virtualization
containerization
AI acceleration
energy efficiency improvements
RAS features
hardware-accelerated cryptography
hardware memory encryption
cloud-native workloads
multi-chip module (MCM)
Matrix Math Assist (MMA)
Memory Inception
Open Memory Interface (OMI)
PowerAXON interconnect
dynamic execution register file
|
|
gptkbp:transistorCount
|
18 billion
|
|
gptkbp:usedIn
|
gptkb:IBM_Power_E1080
gptkb:IBM_Power_S1022
gptkb:IBM_Power_S1024
|
|
gptkbp:bfsParent
|
gptkb:IBM_Power9
|
|
gptkbp:bfsLayer
|
7
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
IBM Power10
|