Statements (26)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
memory technology
|
| gptkbp:abbreviation |
gptkb:HBM3E
|
| gptkbp:announced |
2023
|
| gptkbp:application |
gptkb:machine_learning
data centers supercomputers |
| gptkbp:developedBy |
gptkb:JEDEC
|
| gptkbp:feature |
energy efficiency
high bandwidth 3D-stacked memory wide I/O interface |
| https://www.w3.org/2000/01/rdf-schema#label |
High Bandwidth Memory 3E
|
| gptkbp:maximumBandwidthPerPin |
9.2 Gbps
|
| gptkbp:maximumBandwidthPerStack |
1.2 TB/s
|
| gptkbp:maxStackSize |
24 GB
|
| gptkbp:memoryType |
gptkb:SDRAM
|
| gptkbp:notableBrand |
gptkb:SK_hynix
gptkb:Samsung_Electronics gptkb:Micron_Technology |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:successor |
gptkb:High_Bandwidth_Memory_3
|
| gptkbp:usedIn |
gptkb:AI_accelerators
high-performance computing graphics cards |
| gptkbp:bfsParent |
gptkb:HBM3E
|
| gptkbp:bfsLayer |
7
|