HiSilicon Technologies Co., Ltd.
GPTKB entity
Statements (33)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:company
gptkb:semiconductor_company |
| gptkbp:country |
gptkb:China
|
| gptkbp:focus |
AI chips
networking chips mobile SoCs |
| gptkbp:founded |
2004
|
| gptkbp:headquartersLocation |
gptkb:Shenzhen
|
| gptkbp:industry |
gptkb:industrial_equipment
semiconductors |
| gptkbp:keyPerson |
gptkb:He_Tingbo
|
| gptkbp:market |
gptkb:consumer_electronics
telecommunications |
| gptkbp:notableEvent |
Kirin 9000 launch
US trade restrictions in 2019 development of 5G chips |
| gptkbp:notableProduct |
gptkb:Balong_modems
gptkb:Kirin_mobile_processors |
| gptkbp:numberOfEmployees |
7000+
|
| gptkbp:parentCompany |
gptkb:Huawei
|
| gptkbp:products |
gptkb:microprocessor
gptkb:HiSilicon_Kirin gptkb:HiSilicon_Balong integrated circuits modems |
| gptkbp:serves |
global
|
| gptkbp:servesArea |
worldwide
|
| gptkbp:subsidiary |
gptkb:Huawei
|
| gptkbp:type |
private
|
| gptkbp:website |
https://www.hisilicon.com/
|
| gptkbp:bfsParent |
gptkb:Arm
|
| gptkbp:bfsLayer |
5
|
| https://www.w3.org/2000/01/rdf-schema#label |
HiSilicon Technologies Co., Ltd.
|