Statements (20)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:feature |
thin body
small outline improved heat dissipation exposed thermal pad |
| https://www.w3.org/2000/01/rdf-schema#label |
HTSSOP
|
| gptkbp:manufacturer |
gptkb:Texas_Instruments
|
| gptkbp:pinCountRange |
8 to 64 pins
|
| gptkbp:relatedTo |
gptkb:TSSOP
gptkb:SOIC |
| gptkbp:standsFor |
Heat sink thin shrink small outline package
|
| gptkbp:thermalPerformance |
better than standard TSSOP
|
| gptkbp:type |
PCB
SMD (surface-mount device) |
| gptkbp:usedFor |
surface-mount technology
|
| gptkbp:usedIn |
power management ICs
audio amplifiers automotive electronics |
| gptkbp:bfsParent |
gptkb:TIC44X
|
| gptkbp:bfsLayer |
7
|