Statements (19)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:announced |
2018
|
| gptkbp:category |
3D IC technology
|
| gptkbp:developedBy |
gptkb:Intel
|
| gptkbp:enables |
heterogeneous integration
mixing of different process nodes 3D stacking of logic chips |
| gptkbp:feature |
through-silicon vias (TSVs)
active interposer face-to-face die stacking |
| https://www.w3.org/2000/01/rdf-schema#label |
Foveros 3D stacking
|
| gptkbp:purpose |
improve performance and power efficiency
reduce footprint of chips |
| gptkbp:relatedTo |
chiplet architecture
Intel EMIB |
| gptkbp:usedIn |
Intel Meteor Lake processors
Intel Lakefield processors |
| gptkbp:bfsParent |
gptkb:Lakefield_(microprocessor)
|
| gptkbp:bfsLayer |
6
|