Flip-Chip Pin Grid Array (FC-PGA)
GPTKB entity
Statements (20)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
CPU package type
|
| gptkbp:abbreviation |
gptkb:FC-PGA
|
| gptkbp:category |
microprocessor packaging
|
| gptkbp:feature |
better heat dissipation
flip-chip design die facing down pins on underside |
| https://www.w3.org/2000/01/rdf-schema#label |
Flip-Chip Pin Grid Array (FC-PGA)
|
| gptkbp:introduced |
1999
|
| gptkbp:manufacturer |
gptkb:Intel
|
| gptkbp:replacedBy |
gptkb:Single_Edge_Contact_Cartridge_(SECC)
|
| gptkbp:successor |
gptkb:FC-PGA2
|
| gptkbp:usedBy |
gptkb:Intel_Pentium_4
gptkb:Intel_Celeron gptkb:Intel_Pentium_III |
| gptkbp:usedIn |
Socket 370
Socket 478 |
| gptkbp:bfsParent |
gptkb:Plastic_Pin_Grid_Array_(PPGA)
gptkb:Pin_Grid_Array_(PGA) |
| gptkbp:bfsLayer |
7
|