Statements (61)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:jet_engine
|
| gptkbp:benefits |
Reduced package size
|
| gptkbp:developed_by |
Advanced materials
Research institutions Flip-chip packaging |
| gptkbp:enables |
Improved thermal performance
|
| gptkbp:features |
Flip-chip technology
|
| https://www.w3.org/2000/01/rdf-schema#label |
Flip-Chip Ball Grid Array
|
| gptkbp:is_adopted_by |
Automotive industry
Consumer products High-frequency applications |
| gptkbp:is_analyzed_in |
Finite element analysis
Mechanical stress |
| gptkbp:is_associated_with |
Advanced packaging
|
| gptkbp:is_beneficial_for |
Miniaturization
|
| gptkbp:is_compared_to |
Other packaging types
|
| gptkbp:is_compatible_with |
Surface mount technology
Lead-free soldering |
| gptkbp:is_considered |
Design engineering
|
| gptkbp:is_designed_for |
High-speed signals
|
| gptkbp:is_evaluated_by |
gptkb:Reliability
Performance metrics Thermal analysis Thermal performance Mechanical reliability Electrical reliability |
| gptkbp:is_explored_in |
Academic research
|
| gptkbp:is_influenced_by |
Market trends
|
| gptkbp:is_integrated_with |
Power management ICs
System-on-chip designs Heat spreaders |
| gptkbp:is_known_for |
Lower inductance
|
| gptkbp:is_often_used_in |
Integrated circuits
|
| gptkbp:is_optimized_for |
Cost efficiency
|
| gptkbp:is_part_of |
gptkb:packaging
gptkb:microprocessor Electronic packaging solutions |
| gptkbp:is_recommended_by |
High-density applications
Wire bonding |
| gptkbp:is_recommended_for |
High-performance applications
|
| gptkbp:is_regarded_as |
Innovative technology
|
| gptkbp:is_subject_to |
Quality control
|
| gptkbp:is_supported_by |
Industry standards
|
| gptkbp:is_tested_for |
Environmental conditions
Thermal resistance Thermal cycling Electrical performance |
| gptkbp:is_used_in |
Consumer electronics
Computing devices |
| gptkbp:is_utilized_by |
OEMs
|
| gptkbp:is_utilized_for |
Signal integrity
|
| gptkbp:is_utilized_in |
gptkb:Telecommunications
Medical devices Aerospace applications |
| gptkbp:manufacturer |
Semiconductor companies
Wafer-level packaging |
| gptkbp:provides |
High-density interconnection
|
| gptkbp:used_in |
Electronics
|
| gptkbp:uses |
Solder balls
|
| gptkbp:bfsParent |
gptkb:Power_PC_8540
|
| gptkbp:bfsLayer |
6
|