gptkbp:instance_of
|
gptkb:microprocessor
|
gptkbp:bfsLayer
|
5
|
gptkbp:bfsParent
|
gptkb:EPYC_7003_series
|
gptkbp:application
|
gptkb:Cloud_Computing_Service
data centers
enterprise workloads
|
gptkbp:architectural_style
|
gptkb:Zen_4
|
gptkbp:avionics
|
gptkb:battle
|
gptkbp:cache_size
|
L3 cache
up to 256 MB
|
gptkbp:competitors
|
gptkb:Intel_Xeon
|
gptkbp:events
|
CES 2022
|
gptkbp:first_generation
|
gptkb:battle
|
gptkbp:fuel_capacity
|
high
|
gptkbp:gpu
|
5.0
|
gptkbp:graphics
|
gptkb:battle
|
https://www.w3.org/2000/01/rdf-schema#label
|
EPYC 7004 series
|
gptkbp:hyper_threading
|
gptkb:battle
192
up to 192
|
gptkbp:is_compatible_with
|
x86-64
|
gptkbp:is_supported_by
|
gptkb:battle
|
gptkbp:launch_date
|
gptkb:2022
|
gptkbp:manufacturer
|
gptkb:AMD
|
gptkbp:market
|
varies by model
|
gptkbp:market_segment
|
gptkb:server
|
gptkbp:number_of_cores
|
96
up to 96
|
gptkbp:open_glsupport
|
gptkb:battle
|
gptkbp:overclocking_support
|
gptkb:battle
|
gptkbp:packaging
|
gptkb:battle
|
gptkbp:performance
|
high-performance computing
|
gptkbp:produced_by
|
5 nm
|
gptkbp:ram
|
204.8 GB/s
4 TB
DD R5
up to 4800 MT/s
|
gptkbp:release_date
|
gptkb:2022
|
gptkbp:security_features
|
gptkb:battle
SEV
|
gptkbp:sister_channel
|
8
|
gptkbp:socket_type
|
S P5
|
gptkbp:successor
|
gptkb:EPYC_7003_series
|
gptkbp:supports
|
gptkb:battle
|
gptkbp:tdp
|
120 W to 280 W
|
gptkbp:thermal_design_power
|
varies by model
|
gptkbp:virtualization_support
|
gptkb:battle
|
gptkbp:weight
|
gptkb:battle
|