Statements (36)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
electronic component package
|
| gptkbp:abbreviation |
gptkb:Dual_In-line_Package
|
| gptkbp:alternativeTo |
surface-mount packages
|
| gptkbp:hasFeature |
gptkb:JEDEC
notch or dot for pin 1 identification two parallel rows of pins |
| https://www.w3.org/2000/01/rdf-schema#label |
DIP (Dual In-line Package)
|
| gptkbp:introducedIn |
1960s
|
| gptkbp:material |
gptkb:ceramics
gptkb:plastic |
| gptkbp:pinCount |
14
16 18 20 24 28 40 8 |
| gptkbp:replacedBy |
surface-mount technology (SMT)
|
| gptkbp:type |
through-hole
|
| gptkbp:usedFor |
microprocessors
switches integrated circuits memory chips resistor networks logic chips mounting electronic components |
| gptkbp:usedIn |
prototyping
printed circuit boards (PCBs) breadboards socketed applications |
| gptkbp:bfsParent |
gptkb:Namco_C140
gptkb:BASIC_Stamp_microcontroller gptkb:EPROM_(Erasable_Programmable_Read-Only_Memory) gptkb:original_Agnus_chip |
| gptkbp:bfsLayer |
8
|