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gptkbp:instance_of
|
gptkb:microprocessor
|
|
gptkbp:architectural_style
|
RISC
AR Mv9
|
|
gptkbp:cache_size
|
64 bytes
up to 512 KB
L1 and L2 cache
|
|
gptkbp:competes_with
|
gptkb:Samsung_Exynos
gptkb:physicist
gptkb:Apple_A-series
|
|
gptkbp:connects
|
Cortex-M interconnect
|
|
gptkbp:design
|
high performance and efficiency
|
|
gptkbp:designed_by
|
gptkb:Arm_Holdings
|
|
gptkbp:developer
|
gptkb:Arm_Development_Studio
|
|
gptkbp:features
|
out-of-order execution
dynamic frequency scaling
hardware security features
advanced branch prediction
|
|
gptkbp:fuel_capacity
|
improved
|
|
gptkbp:graphics
|
optional
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Cortex-X3
|
|
gptkbp:is_compatible_with
|
gptkb:ARM_ecosystem
|
|
gptkbp:key
|
low latency
scalability
high throughput
AI acceleration
multi-core support
|
|
gptkbp:language_of_instruction
|
deep pipeline
A Arch64
|
|
gptkbp:market
|
gptkb:2022
|
|
gptkbp:market_segment
|
high-end mobile
|
|
gptkbp:number_of_cores
|
up to 8
|
|
gptkbp:performance
|
high-performance
SPECCPU benchmarks
up to 25% over Cortex-X2
|
|
gptkbp:power_consumption
|
up to 30% over Cortex-X2
|
|
gptkbp:produced_by
|
5 nm
|
|
gptkbp:ram
|
DD R5
LPDD R5
|
|
gptkbp:release_year
|
gptkb:2022
|
|
gptkbp:security_features
|
gptkb:Trust_Zone
|
|
gptkbp:speed
|
up to 3.0 G Hz
|
|
gptkbp:successor
|
gptkb:Cortex-X2
|
|
gptkbp:supports
|
gptkb:software_framework
AI workloads
|
|
gptkbp:target_market
|
gptkb:smartphone
|
|
gptkbp:thermal_design_power
|
variable
|
|
gptkbp:used_in
|
gptkb:smartphone
laptops
tablets
|
|
gptkbp:virtualization_support
|
gptkb:battle
|
|
gptkbp:bfsParent
|
gptkb:ARM_Cortex
|
|
gptkbp:bfsLayer
|
4
|