gptkbp:instance_of
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gptkb:microprocessor
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gptkbp:bfsLayer
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5
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gptkbp:bfsParent
|
gptkb:Cortex-A72
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gptkbp:application
|
Mobile devices
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gptkbp:architectural_style
|
AR Mv8-A
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gptkbp:cache_size
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gptkb:Harvard_architecture
gptkb:battle
64 bytes
optional
up to 512 KB
up to 512 KB L2 cache
32 KB data cache
32 KB instruction cache
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gptkbp:competitors
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gptkb:Qualcomm_Snapdragon_835
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gptkbp:connects
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gptkb:ARM's_AMBA_5_CHI
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gptkbp:design
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High performance and efficiency
Out-of-order execution
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gptkbp:designed_by
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gptkb:CEO
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gptkbp:first_introduced
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gptkb:Samsung_Galaxy_S8
gptkb:Huawei_Mate_9
gptkb:HTC_U11
gptkb:One_Plus_5
gptkb:Xiaomi_Mi_6
|
gptkbp:fuel_capacity
|
high
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gptkbp:gpu
|
gptkb:Mali-G71
|
https://www.w3.org/2000/01/rdf-schema#label
|
Cortex-A73
|
gptkbp:hyper_threading
|
gptkb:battle
|
gptkbp:is_compatible_with
|
AR Mv8-A compatible software
|
gptkbp:language_of_instruction
|
ARM instruction set
|
gptkbp:market
|
gptkb:2016
|
gptkbp:market_segment
|
High-performance mobile
|
gptkbp:number_of_cores
|
up to 8 cores
|
gptkbp:performance
|
gptkb:Geekbench
gptkb:An_Tu_Tu
up to 30% better than Cortex-A72
|
gptkbp:power_consumption
|
Dynamic voltage and frequency scaling
|
gptkbp:produced_by
|
10 nm
|
gptkbp:ram
|
DD R4
LPDD R4
|
gptkbp:release_year
|
gptkb:2016
|
gptkbp:security_features
|
gptkb:Trust_Zone
|
gptkbp:service_branch
|
gptkb:battle
|
gptkbp:speed
|
up to 2.8 G Hz
|
gptkbp:successor
|
gptkb:Cortex-A75
|
gptkbp:supports
|
gptkb:ARM_Debug_Interface
64-bit processing
DSP instructions
NEONSIMD
Cryptography instructions
|
gptkbp:thermal_design_power
|
up to 2.5 W
|
gptkbp:used_in
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gptkb:Io_T_devices
gptkb:smartphone
Tablets
Automotive systems
Wearables
Smart T Vs
|
gptkbp:virtualization_support
|
gptkb:battle
|