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gptkbp:instance_of
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gptkb:microprocessor
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gptkbp:bfsLayer
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5
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gptkbp:bfsParent
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gptkb:Cortex-A55
gptkb:ARM_Cortex-A55
gptkb:Arm_Cortex_processors
|
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gptkbp:application
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Mobile devices
|
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gptkbp:architectural_style
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AR Mv8-A
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gptkbp:cache_size
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MESI protocol
L2 cache: 512 KB
L1 cache: 64 KB per core
L3 cache: 4 MB
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|
gptkbp:connects
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AMBA 5 CHI
|
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gptkbp:designed_by
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gptkb:Arm_Holdings
|
|
gptkbp:developer
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gptkb:Keil_MDK
gptkb:DS-5_Development_Studio
gptkb:Arm_Development_Studio
|
|
gptkbp:features
|
Advanced SIMD
Multi-threading support
Scalable architecture
NEON technology
Cryptography extensions
Floating-point unit
Dynam IQ technology
|
|
gptkbp:fuel_capacity
|
High power efficiency
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Cortex-A65
|
|
gptkbp:language_of_instruction
|
A Arch64
|
|
gptkbp:market
|
gptkb:2017
|
|
gptkbp:market_segment
|
High-end mobile
|
|
gptkbp:number_of_cores
|
Up to 8 cores
|
|
gptkbp:performance
|
High performance
SPE Cfp
SPE Cint
|
|
gptkbp:produced_by
|
7nm process technology
|
|
gptkbp:release_year
|
gptkb:2017
|
|
gptkbp:successor
|
gptkb:Cortex-A76
|
|
gptkbp:supports
|
gptkb:RTOS
gptkb:operating_system
Virtualization
Debug access port
Security extensions
|
|
gptkbp:thermal_design_power
|
Up to 2.5 W
|
|
gptkbp:used_in
|
gptkb:XMPP_Extension_Protocol
gptkb:Io_T_devices
gptkb:smartphone
gptkb:technology
Gaming consoles
Tablets
Embedded systems
Set-top boxes
Automotive applications
Smart T Vs
|