Statements (18)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:company
|
| gptkbp:acquiredBy |
gptkb:JCET
|
| gptkbp:acquisitionYear |
2015
|
| gptkbp:foundedIn |
1999
|
| gptkbp:headquartersLocation |
gptkb:Singapore
|
| gptkbp:industry |
gptkb:microprocessor
|
| gptkbp:parentCompany |
gptkb:JCET
|
| gptkbp:providesService |
testing services
wafer bumping system-in-package (SiP) flip chip assembly wafer level packaging |
| gptkbp:servesIndustry |
electronics
|
| gptkbp:specializesIn |
semiconductor packaging
test services |
| gptkbp:bfsParent |
gptkb:Michael_R._Splinter
|
| gptkbp:bfsLayer |
8
|
| https://www.w3.org/2000/01/rdf-schema#label |
ChipPAC
|