Chinese semiconductor industry
GPTKB entity
Statements (63)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:industry
|
| gptkbp:challenge |
talent shortage
intellectual property issues US export controls limited access to advanced lithography equipment technology gap with leading countries |
| gptkbp:country |
gptkb:China
|
| gptkbp:domesticConsumption |
largest in the world
|
| gptkbp:futureGoals |
global competitiveness
advanced process nodes leadership in AI chips self-sufficiency in semiconductors |
| gptkbp:globalMarketShare |
~15% (2022)
|
| gptkbp:governmentInitiatives |
gptkb:Made_in_China_2025
National IC Industry Investment Fund local government subsidies |
| gptkbp:governmentResponse |
high
|
| https://www.w3.org/2000/01/rdf-schema#label |
Chinese semiconductor industry
|
| gptkbp:importDependence |
semiconductor equipment
electronic design automation advanced chips |
| gptkbp:keyTechnologies |
chip design
packaging innovation memory manufacturing 14nm process technology 28nm process technology |
| gptkbp:majorCity |
gptkb:Beijing
gptkb:Nanjing gptkb:Shanghai gptkb:Suzhou gptkb:Xiamen gptkb:Chengdu gptkb:Shenzhen gptkb:Wuhan gptkb:Xi'an |
| gptkbp:market |
gptkb:Europe
gptkb:Southeast_Asia gptkb:United_States |
| gptkbp:notableCompany |
gptkb:Yangtze_Memory_Technologies
gptkb:SMIC Hua Hong Semiconductor ChangXin Memory Technologies TSMC (China operations) |
| gptkbp:notableEvent |
US blacklisting of SMIC
US sanctions on Huawei establishment of YMTC expansion of domestic foundries increased R&D investment |
| gptkbp:products |
integrated circuits
semiconductor equipment memory chips foundry services |
| gptkbp:R&DSpending |
over $10 billion annually
|
| gptkbp:revenue |
over $150 billion (2022)
|
| gptkbp:sector |
gptkb:microprocessor
|
| gptkbp:supplies |
integrated circuit design
wafer fabrication equipment manufacturing materials supply packaging and testing |
| gptkbp:bfsParent |
gptkb:US–China_semiconductor_restrictions
gptkb:Godson_processors |
| gptkbp:bfsLayer |
8
|