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gptkbp:instance_of
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gptkb:microprocessor
|
|
gptkbp:application
|
scientific computing
|
|
gptkbp:architectural_style
|
vector processing
|
|
gptkbp:cache_size
|
multiple levels
|
|
gptkbp:connects
|
high-speed interconnects
multi-bus system
|
|
gptkbp:cooling_system
|
liquid cooling
|
|
gptkbp:data_usage
|
up to 1 GB/s
|
|
gptkbp:depth
|
3 ft
|
|
gptkbp:design
|
modular
|
|
gptkbp:developer
|
gptkb:1985
gptkb:1990
|
|
gptkbp:discontinued
|
gptkb:1995
|
|
gptkbp:end_of_life
|
gptkb:1995
|
|
gptkbp:height
|
6 ft
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
CRAY-3
|
|
gptkbp:hyper_threading
|
gptkb:battle
|
|
gptkbp:input_output
|
high-speed
|
|
gptkbp:involved_units
|
multiple
|
|
gptkbp:language
|
gptkb:film_production_company
gptkb:C
gptkb:C++
gptkb:Fortran
|
|
gptkbp:language_of_instruction
|
vector instructions
|
|
gptkbp:manufacturer
|
gptkb:Cray_Research
|
|
gptkbp:market
|
gptkb:1990
|
|
gptkbp:market_segment
|
high-performance computing
|
|
gptkbp:notable_features
|
modular design
custom processors
advanced cooling system
large memory capacity
high-speed vector processing
|
|
gptkbp:notable_users
|
gptkb:University_of_Illinois
gptkb:Lawrence_Livermore_National_Laboratory
gptkb:Los_Alamos_National_Laboratory
gptkb:NASA
gptkb:Fermilab
|
|
gptkbp:operating_system
|
gptkb:UNIX
|
|
gptkbp:operational_area
|
data centers
|
|
gptkbp:performance
|
gptkb:FLOPS
up to 1.2 GFLOPS
|
|
gptkbp:power_consumption
|
up to 30 k W
|
|
gptkbp:predecessor
|
gptkb:CRAY-2
|
|
gptkbp:processor
|
up to 8
custom CMOS
|
|
gptkbp:ram
|
up to 256 MB
|
|
gptkbp:release_year
|
gptkb:1990
|
|
gptkbp:sister_channel
|
multiple channels
|
|
gptkbp:successor
|
gptkb:CRAY_T3_E
CRAY T3 D
CRAY-4
|
|
gptkbp:technology
|
CMOS technology
|
|
gptkbp:weight
|
approximately 5,000 lbs
|
|
gptkbp:width
|
4 ft
|
|
gptkbp:bfsParent
|
gptkb:CRAY
|
|
gptkbp:bfsLayer
|
7
|