|
gptkbp:instanceOf
|
gptkb:United_States_federal_law
|
|
gptkbp:abbreviation
|
gptkb:CHIPS_Act
|
|
gptkbp:administeredBy
|
gptkb:National_Science_Foundation
gptkb:United_States_Department_of_Commerce
|
|
gptkbp:category
|
gptkb:United_States_federal_law
gptkb:economic_policy
Industrial policy
Science and technology policy
Semiconductor policy
|
|
gptkbp:citation
|
gptkb:H.R._4346
|
|
gptkbp:enactedBy
|
gptkb:117th_United_States_Congress
|
|
gptkbp:fundedBy
|
$13.2 billion for research and workforce development
$10 billion for regional technology hubs
$39 billion for manufacturing incentives
$2 billion for legacy chips used in automobiles and defense systems
$1.5 billion for promoting wireless supply chain innovation
$52.7 billion for semiconductor manufacturing, research, and development
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
CHIPS Act
|
|
gptkbp:impact
|
addresses supply chain vulnerabilities
encourages domestic semiconductor production
provides tax credits for semiconductor manufacturing investments
strengthens U.S. technological leadership
supports STEM education and workforce development
funds research in artificial intelligence, quantum computing, and advanced manufacturing
|
|
gptkbp:officialName
|
gptkb:CHIPS_and_Science_Act
|
|
gptkbp:passedHouseDate
|
2022-07-27
2022-07-28
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|
gptkbp:prohibits
|
recipients from expanding advanced semiconductor manufacturing in China for 10 years
|
|
gptkbp:publicLawNumber
|
gptkb:Public_Law_117-167
|
|
gptkbp:purpose
|
boost semiconductor manufacturing in the United States
promote scientific research and innovation
|
|
gptkbp:relatedTo
|
gptkb:China
gptkb:National_Institute_of_Standards_and_Technology
gptkb:National_Science_Foundation
gptkb:Office_of_Science_and_Technology_Policy
gptkb:United_States_Department_of_Commerce
semiconductor industry
technology innovation
supply chain resilience
American manufacturing
global competitiveness
|
|
gptkbp:section
|
gptkb:Division_A:_CHIPS_Act_of_2022
gptkb:Division_B:_Research_and_Innovation
gptkb:Division_C:_National_Science_Foundation_for_the_Future_Act
gptkb:Division_D:_Department_of_Energy_Science_for_the_Future_Act
gptkb:Division_E:_Directorate_for_Technology,_Innovation,_and_Partnerships
Division F: Miscellaneous Provisions
|
|
gptkbp:signedBy
|
gptkb:Joe_Biden
2022-08-09
|
|
gptkbp:sponsor
|
gptkb:Senator_Chuck_Schumer
gptkb:Senator_John_Cornyn
|
|
gptkbp:title
|
gptkb:Creating_Helpful_Incentives_to_Produce_Semiconductors_for_America_Act
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|
gptkbp:bfsParent
|
gptkb:CHIPS_and_Science_Act
|
|
gptkbp:bfsLayer
|
5
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