gptkbp:instance_of
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gptkb:microprocessor
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gptkbp:application
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signal processing
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gptkbp:architecture
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DSP architecture
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gptkbp:average_temperature
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-40 to 105 ° C
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gptkbp:challenges
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signal integrity
thermal management
power integrity
EMI compliance
layout complexity
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gptkbp:developed_by
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gptkb:Texas_Instruments
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gptkbp:development_tools
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gptkb:Code_Composer_Studio
gptkb:TI_RTOS
Linux support
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gptkbp:ecosystem
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software libraries
third-party support
application examples
TI E2 E Community
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gptkbp:features
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high performance
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gptkbp:frequency
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up to 1.25 GHz
|
https://www.w3.org/2000/01/rdf-schema#label
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C66x family
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gptkbp:includes
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C6655
C6657
C6670
C6678
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gptkbp:interface
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gptkb:Ethernet
gptkb:I2_C
gptkb:Serial_Rapid_IO
gptkb:PCIe
SPI
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gptkbp:market_segment
|
aerospace
automotive
communications
industrial
medical
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gptkbp:memory_type
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gptkb:Flash
gptkb:SRAM
DDR3
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gptkbp:packaging
|
BGA
FCLGA
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gptkbp:performance
|
up to 320 GMACs
up to 640 GFLOPs
|
gptkbp:power_consumption
|
low power
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gptkbp:security_features
|
encryption support
hardware security
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gptkbp:successor
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gptkb:C67x_family
C66 E family
C66 S family
|
gptkbp:supports
|
real-time processing
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gptkbp:uses
|
multicore processing
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gptkbp:bfsParent
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gptkb:C55x_family
gptkb:C64x_family
gptkb:C67x_family
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gptkbp:bfsLayer
|
7
|