Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
manufacturing equipment
|
| gptkbp:component |
curing oven
die bonder pick and place machine vision inspection system wire bonder |
| gptkbp:controlledBy |
gptkb:PLC
industrial computer |
| gptkbp:feature |
robotic arms
conveyor systems inspection stations bonding machines |
| gptkbp:foundIn |
semiconductor fabrication plant
electronics assembly factory |
| https://www.w3.org/2000/01/rdf-schema#label |
Automated Bonding Line
|
| gptkbp:purpose |
improve product quality
reduce manual labor increase production efficiency |
| gptkbp:usedFor |
semiconductor packaging
automated assembly |
| gptkbp:usedIn |
electronics manufacturing
|
| gptkbp:bfsParent |
gptkb:ABL
|
| gptkbp:bfsLayer |
6
|