Statements (55)
Predicate | Object |
---|---|
gptkbp:instance_of |
gptkb:microprocessor
|
gptkbp:architecture |
gptkb:ARM
|
gptkbp:cache_size |
up to 64 MB L3 cache
|
gptkbp:clock_speed |
3.0 GHz
3.3 GHz |
gptkbp:competitors |
gptkb:Intel_Xeon
gptkb:AMD_EPYC |
gptkbp:designed_by |
gptkb:Ampere_Computing
|
gptkbp:features |
energy efficiency
low latency multiple cores scalability high throughput advanced security features cloud-native architecture high memory bandwidth virtualization support support for microservices support for secure boot flexible deployment support for SIMD instructions support for containers support for Kubernetes support for Docker support for NEON support for SVE support for cryptography instructions support for hardware root of trust support for memory encryption support for trusted execution environment support for virtualization extensions support for SVE2 support for ARMv8.2 support for ARMv8.3 support for ARMv9 |
gptkbp:fuel_economy |
high power efficiency
|
https://www.w3.org/2000/01/rdf-schema#label |
Ampere Altra
|
gptkbp:launch_event |
Hot Chips 2020
|
gptkbp:manufacturer |
gptkb:TSMC
|
gptkbp:manufacturing_process |
7 nm
|
gptkbp:memory_type |
DDR4
|
gptkbp:number_of_cores |
up to 80
|
gptkbp:performance |
high performance
|
gptkbp:release_date |
gptkb:2020
|
gptkbp:socket_type |
LGA 4189
|
gptkbp:successor |
Ampere Altra Max
|
gptkbp:supports |
PCIe 4.0
|
gptkbp:target_market |
gptkb:cloud_computing
|
gptkbp:tdp |
up to 250 W
|
gptkbp:use_case |
data centers
high-performance computing virtualization AI workloads |
gptkbp:bfsParent |
gptkb:Intel_Xeon_Ice_Lake
|
gptkbp:bfsLayer |
6
|