gptkbp:instance_of
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gptkb:microprocessor
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gptkbp:bfsLayer
|
3
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gptkbp:bfsParent
|
gptkb:Snapdragon_835
gptkb:Snapdragon_660
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gptkbp:application
|
gptkb:XMPP_Extension_Protocol
gptkb:internet_of_things_(Io_T)
gptkb:software_framework
gptkb:computer
gptkb:technology
gaming
high-performance computing
industrial automation
multimedia processing
automotive systems
AI processing
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gptkbp:architectural_style
|
AR Mv8-A
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gptkbp:cache_size
|
L1, L2, L3
L1, L2, L3 cache
up to 512 KB
up to 512 KB L2 cache
|
gptkbp:competes_with
|
gptkb:Apple_A10_Fusion
gptkb:Samsung_Exynos_8895
gptkb:Qualcomm_Snapdragon_835
|
gptkbp:design
|
high performance with low power
|
gptkbp:designed_by
|
gptkb:CEO
|
gptkbp:features
|
gptkb:big._LITTLE_architecture
|
gptkbp:fuel_capacity
|
high power efficiency
|
gptkbp:gpu
|
gptkb:Mali-G71
|
gptkbp:graphics
|
gptkb:Mali-G71
|
https://www.w3.org/2000/01/rdf-schema#label
|
ARM Cortex-A73
|
gptkbp:hyper_threading
|
gptkb:battle
|
gptkbp:involved_units
|
gptkb:battle
|
gptkbp:language_of_instruction
|
A Arch64
|
gptkbp:manufacturer
|
various semiconductor companies
|
gptkbp:market
|
gptkb:2016
|
gptkbp:market_segment
|
mobile computing
high-end mobile
|
gptkbp:number_of_cores
|
up to 4
up to 8 cores
|
gptkbp:performance
|
high performance
|
gptkbp:predecessor
|
gptkb:ARM_Cortex-A72
|
gptkbp:produced_by
|
10 nm
10 nm, 16 nm
|
gptkbp:ram
|
DD R4, LPDD R4
|
gptkbp:release_year
|
gptkb:2016
|
gptkbp:security_features
|
gptkb:Trust_Zone
gptkb:Trust_Zone_technology
|
gptkbp:simtype
|
NEON technology
|
gptkbp:speed
|
up to 2.8 G Hz
|
gptkbp:successor
|
gptkb:ARM_Cortex-A72
gptkb:ARM_Cortex-A75
|
gptkbp:supports
|
64-bit computing
|
gptkbp:thermal_design_power
|
up to 2.5 W
|
gptkbp:used_in
|
gptkb:smartphone
embedded systems
tablets
|
gptkbp:virtualization_support
|
gptkb:battle
|