|
gptkbp:instance_of
|
gptkb:microprocessor
|
|
gptkbp:application
|
gptkb:wearable_technology
gptkb:internet_of_things_(Io_T)
gptkb:machine_learning
gptkb:networking
gptkb:smart_home_devices
gaming
high-performance computing
industrial automation
multimedia processing
automotive systems
AI processing
|
|
gptkbp:architecture
|
gptkb:ARMv8-A
|
|
gptkbp:cache_size
|
L1, L2, L3
L1, L2, L3 cache
up to 512 KB
up to 512 KB L2 cache
|
|
gptkbp:clock_speed
|
up to 2.8 GHz
|
|
gptkbp:competes_with
|
gptkb:Apple_A10_Fusion
gptkb:Samsung_Exynos_8895
gptkb:Qualcomm_Snapdragon_835
|
|
gptkbp:design_purpose
|
high performance with low power
|
|
gptkbp:designed_by
|
gptkb:ARM
|
|
gptkbp:features
|
gptkb:big._LITTLE_architecture
|
|
gptkbp:fuel_economy
|
high power efficiency
|
|
gptkbp:gpu
|
gptkb:Mali-G71
|
|
gptkbp:graphics
|
gptkb:Mali-G71
|
|
gptkbp:has_units
|
yes
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
ARM Cortex-A73
|
|
gptkbp:hyper_threading
|
yes
|
|
gptkbp:instruction_set
|
gptkb:AArch64
|
|
gptkbp:manufacturer
|
various semiconductor companies
|
|
gptkbp:manufacturing_process
|
10 nm
10 nm, 16 nm
|
|
gptkbp:market_launch
|
gptkb:2016
|
|
gptkbp:market_segment
|
mobile computing
high-end mobile
|
|
gptkbp:memory_type
|
DDR4, LPDDR4
|
|
gptkbp:number_of_cores
|
up to 4
up to 8 cores
|
|
gptkbp:performance
|
high performance
|
|
gptkbp:predecessor
|
gptkb:ARM_Cortex-A72
|
|
gptkbp:release_year
|
gptkb:2016
|
|
gptkbp:security_features
|
gptkb:Trust_Zone
gptkb:Trust_Zone_technology
|
|
gptkbp:simtype
|
NEON technology
|
|
gptkbp:successor
|
gptkb:ARM_Cortex-A72
gptkb:ARM_Cortex-A75
|
|
gptkbp:support
|
64-bit computing
|
|
gptkbp:thermal_design_power
|
up to 2.5 W
|
|
gptkbp:used_in
|
gptkb:smartphone
embedded systems
tablets
|
|
gptkbp:virtualization_support
|
yes
|
|
gptkbp:bfsParent
|
gptkb:Qualcomm_Snapdragon_636
gptkb:Qualcomm_Snapdragon_660
gptkb:Snapdragon_835
gptkb:Snapdragon_630
gptkb:Snapdragon_660
gptkb:Qualcomm_Snapdragon_630
gptkb:Qualcomm_Snapdragon_632
|
|
gptkbp:bfsLayer
|
6
|