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gptkbp:instance_of
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gptkb:microprocessor
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gptkbp:bfsLayer
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4
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gptkbp:bfsParent
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gptkb:Krait_CPU_architecture
gptkb:ARM_Montserrat
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gptkbp:architectural_style
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AR Mv7-A
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gptkbp:cache_size
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gptkb:Harvard_architecture
64 bytes
L2 cache 1 MB
L1 cache 32 KB per core
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gptkbp:designed_by
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gptkb:CEO
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gptkbp:developer
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gptkb:ARM_Development_Studio
gptkb:GNU_Toolchain
gptkb:Keil_MDK
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gptkbp:graphics
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integrated GPU support
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|
https://www.w3.org/2000/01/rdf-schema#label
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ARM Cortex-A15
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gptkbp:hyper_threading
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gptkb:battle
|
|
gptkbp:language_of_instruction
|
ARM instruction set
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|
gptkbp:manufacturer
|
various semiconductor companies
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gptkbp:market
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gptkb:2011
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|
gptkbp:market_segment
|
mobile computing
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gptkbp:notable_products
|
gptkb:Google_Nexus_10
gptkb:Amazon_Kindle_Fire_HDX
Samsung Galaxy SIII
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|
gptkbp:number_of_cores
|
1 to 4
|
|
gptkbp:participated_in
|
gptkb:Intel_Atom
gptkb:physicist
gptkb:NVIDIA_Tegra
|
|
gptkbp:performance
|
high performance for mobile devices
higher than Cortex-A9
|
|
gptkbp:power_consumption
|
low power consumption
|
|
gptkbp:predecessor
|
gptkb:ARM_Cortex-A9
|
|
gptkbp:ram
|
gptkb:AMBA_4_AXI
up to 4 GBRAM
|
|
gptkbp:release_year
|
gptkb:2010
|
|
gptkbp:security_features
|
hardware security features
|
|
gptkbp:size
|
approximately 10 mm²
|
|
gptkbp:speed
|
up to 2.5 G Hz
|
|
gptkbp:successor
|
gptkb:ARM_Cortex-A17
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gptkbp:supports
|
gptkb:RTOS
gptkb:SWD
gptkb:operating_system
gptkb:Windows_Embedded
gptkb:Trust_Zone_technology
multiple operating systems
ETM
JTAG
NEONSIMD
|
|
gptkbp:thermal_design_power
|
up to 2.5 W
|
|
gptkbp:used_in
|
gptkb:XMPP_Extension_Protocol
gptkb:smartphone
automotive applications
embedded systems
industrial automation
tablets
set-top boxes
digital T Vs
|
|
gptkbp:virtualization_support
|
gptkb:battle
|