Triple

T22017107
Position Surface form Disambiguated ID Type / Status
Subject Apple A9X E543741 entity
Predicate fabricationProcess P625 FINISHED
Object TSMC 16FF+
TSMC 16FF+ is Taiwan Semiconductor Manufacturing Company’s enhanced 16-nanometer FinFET process node, designed to deliver higher performance and energy efficiency for advanced mobile and computing chips.
 E1513857 NE FINISHED

How this triple was built (4 steps)

Every LLM step that produced this triple, in pipeline order — named-entity classification, the disambiguation choices (the exact options shown, with the pick highlighted), and the generated description. The batch + timestamp of each is in the Provenance table below.

NER Named-entity recognition gpt-5-mini
Instruction
Given a phrase, classify it is english named entity (e.g., persons, organizations, works of art) in Latin script, or not (e.g., literals, dates, URLs, verbose phrases). For disambiguation, the statement where the phrase occurs as object is also given. Please return a JSON object with `phrase` (string, the phrase being analyzed) and `is_ne` (boolean, indicating whether the phrase is a Named Entity).
Input
Phrase: TSMC 16FF+ | Statement: [Apple A9X, fabricationProcess, TSMC 16FF+]
NED1 Entity disambiguation (via context triple) gpt-5-mini-2025-08-07 
Target entity: TSMC 16FF+
Context triple: [Apple A9X, fabricationProcess, TSMC 16FF+]
  • A. TSMC N5
    TSMC N5 is Taiwan Semiconductor Manufacturing Company’s 5-nanometer-class process technology node, widely used for advanced high-performance and mobile chips.
  • B. TSMC N7P
    TSMC N7P is an enhanced 7-nanometer semiconductor manufacturing process from TSMC that offers improved performance and power efficiency over its predecessor and is used for advanced mobile and computing chips.
  • C. TSMC N4
    TSMC N4 is an enhanced 5 nm-class semiconductor manufacturing process node from Taiwan Semiconductor Manufacturing Company, offering improved performance and density over its earlier 5 nm technologies.
  • D. TSMC 4N
    TSMC 4N is a custom 5 nm-class semiconductor manufacturing process co-developed by TSMC and NVIDIA, optimized specifically for NVIDIA’s latest GPUs to improve performance, power efficiency, and density over previous nodes.
  • E. TSMC N3B
    TSMC N3B is an advanced 3-nanometer semiconductor manufacturing process variant developed by TSMC, optimized for high-performance, power-efficient chips used in cutting-edge mobile devices.
  • F. None of above. chosen
  • G. Unsure - the case is ambiguous/there is not enough information to decide.
NEDg Description generation gpt-5.1
Instruction
Generate a one-sentence description of the target entity. 
You are given a context triple in the form (subject, predicate, object), where the object is the target entity. 
# Instructions
Use the triple to infer relevant information about the entity. Describe the entity based on what is most defining, well-known. 
Avoid repeating the information from the triple, unless really essential.
# Response Format
Return only the sentence: "Description: [one-sentence description of the target entity]"
Input
Entity: TSMC 16FF+
Triple: [Apple A9X, fabricationProcess, TSMC 16FF+]
Generated description
TSMC 16FF+ is Taiwan Semiconductor Manufacturing Company’s enhanced 16-nanometer FinFET process node, designed to deliver higher performance and energy efficiency for advanced mobile and computing chips.
NED2 Entity disambiguation (via description) gpt-5-mini-2025-08-07 
Target entity: TSMC 16FF+
Target entity description: TSMC 16FF+ is Taiwan Semiconductor Manufacturing Company’s enhanced 16-nanometer FinFET process node, designed to deliver higher performance and energy efficiency for advanced mobile and computing chips.
  • A. TSMC N5
    TSMC N5 is Taiwan Semiconductor Manufacturing Company’s 5-nanometer-class process technology node, widely used for advanced high-performance and mobile chips.
  • B. TSMC N7P
    TSMC N7P is an enhanced 7-nanometer semiconductor manufacturing process from TSMC that offers improved performance and power efficiency over its predecessor and is used for advanced mobile and computing chips.
  • C. TSMC N4
    TSMC N4 is an enhanced 5 nm-class semiconductor manufacturing process node from Taiwan Semiconductor Manufacturing Company, offering improved performance and density over its earlier 5 nm technologies.
  • D. TSMC 4N
    TSMC 4N is a custom 5 nm-class semiconductor manufacturing process co-developed by TSMC and NVIDIA, optimized specifically for NVIDIA’s latest GPUs to improve performance, power efficiency, and density over previous nodes.
  • E. TSMC N3B
    TSMC N3B is an advanced 3-nanometer semiconductor manufacturing process variant developed by TSMC, optimized for high-performance, power-efficient chips used in cutting-edge mobile devices.
  • F. None of above. chosen

Provenance (5 batches)

The batch behind each pipeline step, in order, with when it ran. Timestamps are batch-level — stages were processed in waves, so the object chain (NER → NED1 → NEDg → NED2) reads in order, but predicate / elicitation batches can sit in a different wave.

Step Stage Batch ID Status When
creating Elicitation batch_69e11e2e8ea4819084210fe06d3a1b8d completed April 16, 2026, 5:36 p.m.
NER Named-entity recognition batch_69f127c4e0088190a5241d1b87d746da completed April 28, 2026, 9:33 p.m.
NED1 Entity disambiguation (via context triple) batch_6a0a7381c4b8819086514b9422cd6a0c completed May 18, 2026, 2:03 a.m.
NEDg Description generation batch_6a0a74e81da881908c73d864258dcdd5 completed May 18, 2026, 2:09 a.m.
NED2 Entity disambiguation (via description) batch_6a0a75ce1ed88190be60d0ed29a056ba completed May 18, 2026, 2:13 a.m.
Created at: April 16, 2026, 8:23 p.m.