Statements (60)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:coolingSystem |
Varies by processor
|
| gptkbp:features |
Multiple power phases
|
| gptkbp:hasCitations |
Varies by manufacturer
|
| gptkbp:hasCountry |
1168
|
| gptkbp:hasPerformance |
gptkb:LGA
|
| https://www.w3.org/2000/01/rdf-schema#label |
Socket BGA1168
|
| gptkbp:isAvailableIn |
Different materials
Different colors Different package sizes Retail and bulk packaging |
| gptkbp:isCompatibleWith |
gptkb:Intel_processors
gptkb:AMD_processors Graphics cards Various operating systems Various software applications Various architectures Various cooling solutions Various peripherals Various standards |
| gptkbp:isDesignedFor |
Embedded systems
Desktop computers IoT devices High-performance applications Artificial intelligence applications |
| gptkbp:isFundedBy |
Various manufacturers
|
| gptkbp:isKnownFor |
Energy efficiency
Scalability High-speed data transfer Low latency |
| gptkbp:isPartOf |
Consumer electronics
Gaming consoles Telecommunications equipment Motherboard Networking equipment Chipset High-performance laptops Server motherboards Automotive_systems |
| gptkbp:isTestedFor |
Reliability
Compatibility Thermal performance Electrical performance |
| gptkbp:isUsedIn |
Data centers
Robotics High-performance computing Gaming PCs Smart devices Workstations Home automation systems Cloud computing environments Virtual reality systems Machine learning systems |
| gptkbp:supportedBy |
DDR4
|
| gptkbp:supports |
Multiple cores
Overclocking High bandwidth Various microprocessors Multiple interfaces |
| gptkbp:usedFor |
Mounting Ball Grid Array (BGA) chips
|