|
gptkbp:instance_of
|
gptkb:microprocessor
|
|
gptkbp:architecture
|
x86-64
|
|
gptkbp:cache_size
|
L3 cache
up to 60 MB
|
|
gptkbp:clock_speed
|
up to 4.0 GHz
|
|
gptkbp:competitors
|
gptkb:AMD_EPYC
|
|
gptkbp:features
|
gptkb:Reliability
Scalability
Availability
Serviceability
|
|
gptkbp:first_generation
|
gptkb:Sandy_Bridge
gptkb:Cascade_Lake
gptkb:Broadwell
gptkb:Westmere
gptkb:Nehalem
gptkb:Ice_Lake
gptkb:Woodcrest
Skylake
Clarkdale
Haswell
Paxville
|
|
gptkbp:first_introduced
|
gptkb:1998
|
|
gptkbp:form_factor
|
multi-socket
|
|
gptkbp:graphics
|
not supported
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Intel Xeon series
|
|
gptkbp:hyper_threading
|
supported
|
|
gptkbp:launch_date
|
gptkb:2019
gptkb:2020
|
|
gptkbp:manufacturing_process
|
10 nm
|
|
gptkbp:market_segment
|
high-performance computing
|
|
gptkbp:memory_type
|
DDR4
|
|
gptkbp:number_of_cores
|
up to 56
|
|
gptkbp:power_consumption
|
up to 205 W
|
|
gptkbp:produced_by
|
gptkb:Intel_Corporation
|
|
gptkbp:ram
|
up to 204.8 GB/s
|
|
gptkbp:security_features
|
gptkb:TPM
gptkb:Intel_TXT
gptkb:Intel_SGX
gptkb:AES-NI
|
|
gptkbp:sister_channel
|
up to 8
|
|
gptkbp:slisupport
|
supported
|
|
gptkbp:socket_type
|
LGA 3647
|
|
gptkbp:support
|
gptkb:cloud_computing
gptkb:machine_learning
big data
data analytics
high-performance computing
virtualization
AI workloads
|
|
gptkbp:target_market
|
gptkb:servers
|
|
gptkbp:thermal_design_power
|
up to 270 W
|
|
gptkbp:virtualization_support
|
VT-x and VT-d
|
|
gptkbp:bfsParent
|
gptkb:microprocessor
|
|
gptkbp:bfsLayer
|
4
|