gptkbp:instance_of
|
gptkb:microprocessor
|
gptkbp:ai
|
gptkb:Yes
|
gptkbp:aienhancements
|
gptkb:Yes
|
gptkbp:aiworkloads
|
Optimized for AI workloads
|
gptkbp:analytics
|
Enhanced data analytics performance
|
gptkbp:application
|
gptkb:Yes
|
gptkbp:architecture
|
x86-64
|
gptkbp:availability
|
Designed for high availability
|
gptkbp:cache_size
|
Multi-level cache
up to 105 MB L3
|
gptkbp:cloud_integration
|
gptkb:Yes
|
gptkbp:cloud_optimized
|
gptkb:Yes
|
gptkbp:compatibility
|
gptkb:Intel_600_series
gptkb:Yes
|
gptkbp:competitors
|
gptkb:AMD_EPYC
|
gptkbp:developer
|
gptkb:Yes
|
gptkbp:features
|
gptkb:CXL_1.1
gptkb:PCIe_5.0
|
gptkbp:form_factor
|
gptkb:servers
Multi-socket
|
gptkbp:fuel_economy
|
Improved over previous generations
|
gptkbp:graphics
|
No
|
gptkbp:has_programs
|
gptkb:cloud_computing
|
gptkbp:hosted_by
|
gptkb:Yes
|
https://www.w3.org/2000/01/rdf-schema#label
|
Intel Xeon Sapphire Rapids
|
gptkbp:hyper_threading
|
gptkb:112
Supported
|
gptkbp:instruction_set
|
SSE, AVX, AVX2, AVX-512
|
gptkbp:is_scalable
|
Highly scalable
|
gptkbp:key_concept
|
gptkb:Intel_Speed_Select_Technology
|
gptkbp:launch_date
|
gptkb:2022
September 2022
|
gptkbp:launch_event
|
gptkb:Intel_Innovation_2022
|
gptkbp:launch_price
|
varies by configuration
|
gptkbp:manufacturer
|
gptkb:Intel_Corporation
|
gptkbp:manufacturing_process
|
10 nm
|
gptkbp:market_launch
|
gptkb:2023
|
gptkbp:market_segment
|
gptkb:enterprise_solutions
|
gptkbp:memory_type
|
DDR5
|
gptkbp:number_of_cores
|
56
|
gptkbp:overclocking_support
|
gptkb:Limited
|
gptkbp:performance
|
high-performance computing
|
gptkbp:platforms
|
gptkb:Yes
|
gptkbp:power_consumption
|
Improved
Advanced power management features
|
gptkbp:processor
|
gptkb:Yes
|
gptkbp:provides_information_on
|
gptkb:Yes
|
gptkbp:provides_support_for
|
gptkb:Yes
|
gptkbp:ram
|
up to 4 TB
up to 76.8 GB/s
|
gptkbp:release_date
|
gptkb:2022
|
gptkbp:security_features
|
gptkb:Intel_SGX
|
gptkbp:services_provided
|
gptkb:Yes
|
gptkbp:sister_channel
|
8
|
gptkbp:slisupport
|
gptkb:Yes
|
gptkbp:socket_type
|
gptkb:LGA_4677
|
gptkbp:successor
|
gptkb:Intel_Xeon_Ice_Lake
|
gptkbp:support_for_artificial_intelligence
|
gptkb:Yes
|
gptkbp:support_for_content_delivery_networks
|
gptkb:Yes
|
gptkbp:support_for_data_science
|
gptkb:Yes
|
gptkbp:support_for_virtual_desktop_infrastructure
|
gptkb:Yes
|
gptkbp:supports
|
gptkb:Yes
|
gptkbp:target_market
|
Data centers
|
gptkbp:tdp
|
up to 350 W
|
gptkbp:thermal_design_power
|
350 W
|
gptkbp:type_of
|
gptkb:Yes
|
gptkbp:virtualization_support
|
gptkb:Yes
|
gptkbp:bfsParent
|
gptkb:Intel_Xeon_Ice_Lake
|
gptkbp:bfsLayer
|
6
|