gptkbp:instanceOf
|
gptkb:microprocessor
|
gptkbp:architect
|
x86-64
|
gptkbp:availability
|
widely available
|
gptkbp:avionics
|
supported
|
gptkbp:compatibleWith
|
compatible with existing software
|
gptkbp:competesWith
|
gptkb:AMD_EPYC
|
gptkbp:component
|
optimized for
|
gptkbp:coolingSystem
|
varies by model
|
gptkbp:customerBase
|
gptkb:LGA_4189
|
gptkbp:ecosystem
|
broad partner ecosystem
|
gptkbp:energyEfficiency
|
improved
|
gptkbp:environmentalImpact
|
80
supported
|
gptkbp:features
|
enhanced security
|
gptkbp:formFactor
|
multi-socket
|
gptkbp:highestPoint
|
40
|
https://www.w3.org/2000/01/rdf-schema#label
|
Intel Xeon Ice Lake
|
gptkbp:is_integrated_with
|
gptkb:Intel_UHD_Graphics
|
gptkbp:isAimedAt
|
supported
|
gptkbp:isStudiedIn
|
Intel DL Boost
|
gptkbp:isSupportedBy
|
gptkb:Intel_VT-x
|
gptkbp:keyEvent
|
Intel_Architecture_Day_2020
|
gptkbp:keyIssues
|
support for advanced analytics
|
gptkbp:launched
|
Intel's_2020_roadmap
|
gptkbp:majorRivers
|
64
|
gptkbp:manufacturer
|
gptkb:Intel_Corporation
|
gptkbp:market
|
Q2 2021
|
gptkbp:marketSegment
|
server
|
gptkbp:offers
|
varies by model
|
gptkbp:operationalStatus
|
enhanced support
|
gptkbp:overclockingSupport
|
2.0 GHz
4.0 GHz
|
gptkbp:performance
|
high
high-performance computing
benchmarked against competitors
improved over previous generations
|
gptkbp:productLine
|
Xeon_Scalable_Processors
|
gptkbp:RAM
|
6
DDR4
up to 204.8 GB/s
30 MB L3
|
gptkbp:releaseDate
|
April 2021
|
gptkbp:security
|
gptkb:Intel_SGX
|
gptkbp:successor
|
gptkb:Intel_Xeon_Sapphire_Rapids
|
gptkbp:supports
|
5G networks
|
gptkbp:sustainability
|
designed for energy efficiency
|
gptkbp:targetMarket
|
enterprise customers
|
gptkbp:targets
|
data centers
|
gptkbp:TDP
|
205 W
|
gptkbp:technology
|
10 nm
|
gptkbp:tour
|
part_of_Intel's_future_roadmap
|
gptkbp:workLocation
|
AI and ML workloads
|