Statements (22)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:Company
|
| gptkbp:aims_to |
reduce heat generation
|
| gptkbp:competes_with |
7nm technology
|
| gptkbp:developed_by |
gptkb:Intel_Corporation
|
| gptkbp:enables |
higher clock speeds
|
| gptkbp:features |
higher transistor density
improved power efficiency |
| gptkbp:first_introduced |
gptkb:2018
|
| https://www.w3.org/2000/01/rdf-schema#label |
Intel 10nm technology
|
| gptkbp:improves |
overall performance
|
| gptkbp:includes |
Super Fin technology
|
| gptkbp:is_based_on |
extreme ultraviolet lithography (EUV)
|
| gptkbp:is_part_of |
Intel's process technology roadmap
|
| gptkbp:is_used_in |
gptkb:Intel_Core_processors
gptkb:Intel_Xe_graphics |
| gptkbp:manufacturing_process |
Fin FET
|
| gptkbp:successor |
Intel 14nm technology
|
| gptkbp:supports |
AI workloads
|
| gptkbp:target_market |
high-performance computing
|
| gptkbp:used_in |
gptkb:microprocessor
|
| gptkbp:bfsParent |
gptkb:Intel_7_process_technology
|
| gptkbp:bfsLayer |
6
|